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US 8,618,652 B2Granted
Forming functionalized carrier structures with coreless packages
AssigneeIntel Corporation
InventorsRavi K Nalla, John S Guzek, Javier Soto Gonzalez, Drew W Delaney, Hamid R Azimi
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Abstract
Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include attaching a die to a carrier material, wherein the carrier material comprises a top layer and a bottom layer separated by an etch stop layer; forming a dielectric material adjacent the die, forming a coreless substrate by building up layers on the dielectric material, and then removing the top layer carrier material and etch stop layer from the bottom layer carrier material.
Claims15
A method comprising;
- forming a cavity in a carrier material, wherein the carrier material comprises a top layer and a bottom layer separated by an etch stop layer;
- attaching a die in the cavity;
- forming a dielectric material adjacent the die and on the carrier material bottom layer;
- forming a coreless substrate by building up layers on the dielectric material;
- and
- removing the carrier material top layer and etch stop layer from the bottom layer of the carrier material.
3 more elements
A structure comprising:
- a die embedded in a coreless substrate;
- the coreless substrate including a dielectric material adjacent the die;
- die pad interconnect structures disposed in a die pad area of the die;
- and
- at least one functionalized carrier structure disposed within the coreless substrate, wherein a top surface of the at least one functionalized carrier structure is coplanar with a top surface of the coreless substrate and a back side of the microelectronic die.
2 more elements
Dependencies are inferred from the claim text.