Flange package for a semiconductor device
AssigneeEstivation Properties LLC
InventorsAlex Elliott, Phuong T. Le
Life of this patent
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Abstract
In accordance with one or more embodiments, a flange package comprises a flange and an interposer having two or more fingers disposed in an interposer trench. The flange has a mold lock formed about a periphery of the interposer trench. A dielectric ring comprising a dielectric material is formed in the interposer trench, and in and around the periphery of the mold lock. A semiconductor die is disposed within the dielectric ring having gate pads and source pads formed on a first side, and having drain pads disposed on a second side of the die. The gate pads are coupled to the interposer and the source pads are coupled to the flange. A gate lead is coupled to the interposer and a drain lead is coupled to the drain pads. Other embodiments are disclosed.
Claims20
An apparatus comprising:
- a substrate;
- an interposer trench formed within the substrate;
- a mold lock formed within the substrate and about the interposer trench, wherein the mold lock includes an alignment structure formed thereon;
- and
- a channel that extends between the interposer trench and the mold lock.
An apparatus comprising:
- a substrate;
- an interposer trench formed within the substrate;
- a mold lock formed within the substrate and about the interposer trench, wherein the mold lock includes an alignment structure formed thereon;
- and
- a trench extension extending from the interposer trench, wherein the trench extension and the interposer trench surround a plurality of contacts formed on the substrate.
An apparatus comprising:
- a substrate;
- an interposer trench formed within the substrate;
- a mold lock formed within the substrate and about the interposer trench, wherein the mold lock includes an alignment structure formed thereon;
- and
- a first opening on a first side of the substrate and a second opening on a second side of the substrate opposite the first side, wherein both the first opening and the second opening extend entirely through the substrate.
A method comprising:
- forming an interposer trench within a substrate of a flange;
- and
- forming a mold lock within the substrate about the interposer trench, wherein the mold lock includes one or more alignment structures formed thereon;
- and
- forming a channel that extends between the interposer trench and the mold lock.
A method comprising:
- forming an interposer trench within a substrate of a flange;
- and
- forming a mold lock within the substrate about the interposer trench, wherein the mold lock includes one or more alignment structures formed thereon;
- and
- wherein said forming an interposer trench and said forming a mold lock are performed during a same processing step.
Dependencies are inferred from the claim text.