Electronic device and manufacturing thereof

A device comprising:

• a carrier;
• a semiconductor chip having a control electrode and a first load electrode on a first surface and a second load electrode on a second surface opposite to the first surface, the semiconductor chip being placed over the carrier with its second surface facing the carrier;
• a first lead electrically coupled to the control electrode;
• a second lead electrically coupled to the first load electrode, at least a part of the second lead being arranged between the first lead and the carrier;
• a third lead electrically coupled to the first load electrode;
• and
• a fourth lead contiguous with the carrier, at least one of the second and third leads being arranged between the first and fourth leads,
• wherein the second lead is arranged between the first and fourth leads, and
• wherein the first lead is arranged between the second and third leads.

A device comprising:

• a carrier;
• a semiconductor chip having a control electrode and a first load electrode on a first surface and a second load electrode on a second surface opposite to the first surface, the semiconductor chip being placed over the carrier with its second surface facing the carrier;
• a first lead electrically coupled to the control electrode;
• a second lead electrically coupled to the first load electrode;
• a third lead electrically coupled to the first load electrode, at least a part of the third lead being arranged between the first lead and the carrier;
• and
• a fourth lead contiguous with the carrier, at least one of the second and third leads being arranged between the first and fourth leads,
• wherein the third lead is arranged between the first and fourth leads, and
• wherein the first lead is arranged between the second and third leads.