Semiconductor device and lead frame used for the same
AssigneeKabushiki Kaisha Toshiba
InventorYoshiaki Goto
Life of this patent
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Abstract
A lead frame includes a first outer lead portion and a second outer lead portion which is arranged to oppose to the first outer lead portion with an element-mounting region between them. An inner lead portion has first inner leads connected to the first outer leads and second inner leads connected to the second outer leads. At least either the first or second inner leads are routed in the element-mounting region. An insulation resin is filled in the gaps between the inner leads located on the element-mounting region. A semiconductor device is configured with semiconductor elements mounted on both the top and bottom surfaces of the lead frame.
Claims15
A lead frame, comprising:
- an element-mounting region;
- an outer lead portion having a plurality of outer leads;
- an inner lead portion having a plurality of inner leads, at least part of the inner leads being routed in the element-mounting region;
- and
- an element supporting portion provided in a region other than a region where the inner leads are present in the element-mounting region,
- wherein the element supporting portion has a plurality of first hanging leads provided at a first long edge side of a rectangular region of the lead frame sealed with a resin, and a second hanging lead provided at a second long edge side of the sealed rectangular region,
- wherein the first hanging leads extend from the element supporting portion to the first long edge side of the sealed rectangular region,
- wherein the second hanging lead extends from the element supporting portion to the second long edge side of the sealed rectangular region,
- wherein the outer leads are arranged at first and second short edge sides of the sealed rectangular region,
- wherein one end of the inner leads is arranged at the second long edge side of the sealed rectangular region,
- wherein a part of the inner leads has:
- a first portion extended to the one end of the inner leads, a second portion extended to the outer leads arranged at the first short edge side of the sealed rectangular region, and a third portion routed in the element-mounting region so as to extend in a direction which intersects the first and second portions,
- wherein another part of the inner leads has:
- a fourth portion extended to the one end of the inner leads, a fifth portion extended to the outer leads arranged at the second short edge side of the sealed rectangular region, and a sixth portion routed in the element-mounting region so as to extend in a direction which intersects the fourth and fifth portions, and
- wherein the element supporting portion is provided in a region between the third portion and the sixth portion.
Dependencies are inferred from the claim text.