Semiconductor device

Abstract

A semiconductor device according to the present invention includes: a first semiconductor substrate CHP1 including a control circuit that generates a control signal for a control target circuit, and a transmission circuit Tx that modulates the control signal to generate a transmission signal; a second semiconductor substrate CHP2 including a reception circuit Rx that demodulates the transmission signal transmitted from the transmission circuit to reproduce the control signal, and a drive circuit Drv that drives the control target circuit based on the control signal output from the reception circuit, the second semiconductor substrate CHP2 being electrically insulated from the first semiconductor substrate CHP1; an AC coupling element that is formed on a semiconductor substrate and couples the first semiconductor substrate CHP1 and the second semiconductor substrate CHP2 in an alternating manner; and a semiconductor package 20 including the first semiconductor substrate CHP1, the second semiconductor substrate CHP2, and the AC coupling element. This suppresses an increase in circuit area or mounting area.

Dependencies are inferred from the claim text.