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US 8,618,620 B2Granted
Pressure sensor package systems and methods
AssigneeInfineon Technologies AG
InventorsBernhard Winkler, Rainer Leuschner, Horst Theuss
Life of this patent
Estimating the term…
Abstract
Embodiments relate to integrated circuit (IC) sensors and sensing systems and methods. In an embodiment, an IC sensor device includes at least one sensing element; a framing element disposed around the at least one sensing element at a wafer-level; and a package having at least one port predefined at the wafer-level by the framing element, the at least one port configured to expose at least a portion of the at least one sensing element to an ambient environment.
Claims19
An integrated circuit (IC) sensor device comprising:
- at least one sensing element;
- a framing element disposed around the at least one sensing element at a wafer-level;
- a package having at least one port predefined at the wafer-level by the framing element, the at least one port configured to expose at least a portion of the at least one sensing element to an ambient environment;
- and
- a material layer applied over the at least one sensing element in the at least one port.
2 more elements
A micro-electromechanical system (MEMS) pressure sensor comprising:
- a sensor die comprising first and second sensing elements each including a movable membrane and a cavity;
- and
- a sensor package substantially enclosing the sensor die and comprising a first frame element disposed around the first sensing element at a wafer level to define a first port on a first side of the sensor package, and a second frame element disposed around the second sensing element at a wafer level to define a second port spaced apart from the first port on the first side of the package, the first and second ports configured to expose at least a portion of the first and second sensing elements, respectively, to an ambient environment, the first and second sensing elements forming a differential sensor.
Dependencies are inferred from the claim text.