Top port with interposer MEMS microphone package and method

A top port Micro Electro Mechanical Systems (MEMS) package comprising:

• a substrate comprising a first planar surface;
• an interposer coupled to the substrate, the interposer comprising:
• a first surface;
• a second surface;
• an interposer channel standoff formed on the second surface of the interposer, the second surface being coupled to the first planar surface of the substrate by the interposer channel standoff;
• an interposer aperture extending through the interposer between the first surface of the interposer and the second surface of the interposer;
• and
• an interposer channel fluidly coupled to the interposer aperture, the second surface of the interposer and the interposer channel standoff defining the interposer channel, the interposer aperture and the interposer channel being sealed by the first planar surface of the substrate;
• a MEMS electronic component coupled to the interposer, the MEMS electronic component comprising an aperture fluidly coupled to the interposer aperture;
• and
• a top port lid comprising a top port fluidly coupled to the interposer channel, the top port lid comprising a lid sidewall base attached to the first planar surface of the substrate.

A top port Micro Electro Mechanical Systems (MEMS) package comprising:

• a substrate comprising a first planar surface;
• an interposer coupled to the substrate, the interposer comprising:
• a first surface;
• a second surface coupled to the substrate;
• an interposer aperture extending through the interposer between the first surface of the interposer and the second surface of the interposer;
• and
• an interposer channel fluidly coupled to the interposer aperture, wherein the interposer channel comprises an interposer slot defined by interposer slot sidewalls extending through the interposer between the first surface of the interposer and the second surface of the interposer, the interposer aperture and the interposer channel being sealed by the first planar surface of the substrate;
• a MEMS electronic component coupled to the interposer, the MEMS electronic component comprising an aperture fluidly coupled to the interposer aperture;
• and
• a top port lid comprising a top port fluidly coupled to the interposer channel, the top port lid comprising a lid sidewall base attached to the first planar surface of the substrate.

A top port Micro Electro Mechanical Systems (MEMS) package comprising:

• a converter electronic component comprising a first surface;
• an interposer comprising a first surface and a second surface opposite the first surface of the interposer, the second surface of the interposer being coupled to the first surface of the converter electronic component, the interposer comprising:
• an interposer aperture;
• and
• an interposer channel fluidly coupled to the interposer aperture, the interposer aperture and the interposer channel being sealed by the first surface of the converter electronic component;
• a MEMS electronic component coupled to the first surface of the interposer above the interposer aperture;
• a top port lid comprising:
• a top port;
• and
• a chimney structure comprising a flue fluidly coupled to the top port, an outlet port of the flue being fluidly coupled to an inlet port of the interposer channel.

A method comprising:

• forming an interposer aperture defined by a cylindrical interposer aperture sidewall and an interposer channel in an interposer, the interposer channel comprising an outlet port within the cylindrical interposer aperture sidewall;
• coupling the interposer to a substrate comprising sealing the interposer aperture and the interposer channel by a first planar surface of the substrate;
• coupling a Micro Electro Mechanical Systems (MEMS) electronic component to the interposer above the interposer aperture;
• and
• attaching a lid sidewall base of a top port lid to the first planar surface of the substrate such that a top port of the top port lid is fluidly coupled to an inlet port of interposer channel.