Back to results
US 8,618,604 B2Granted
Semiconductor device and method of manufacturing the same
AssigneeMitsubishi Electric Corporation
InventorAtsushi Narazaki
Life of this patent
Estimating the term…
Abstract
A semiconductor wafer has a main surface. A main chip region is formed on the main surface. A sub-chip region is smaller in area than the main chip region, and positioned on an edge side of the semiconductor wafer relative to the main chip region. The sub-chip region is identical to the main chip region in design pattern. Accordingly, a semiconductor device in which occurrence of a pattern failure at the edge of the wafer can be prevented when chips are arranged in the surface of the semiconductor wafer and a method of manufacturing the same can be obtained.
Claims14
A semiconductor device comprising:
- a semiconductor wafer having a main surface;
- a plurality of first chip regions arranged in matrix form in said main surface;
- a plurality of second chip regions arranged adjacent to said plurality of first chip regions in said main surface to surround a periphery of a region where said plurality of first chip regions are arranged;
- and
- a blank region arranged in an outer region on the main surface of the semiconductor wafer so that neither the first chip regions nor the second chip regions reach a circumferential edge of the semiconductor wafer, wherein
- said second chip regions are smaller in area than said first chip regions,
- each of the plurality of first chip regions has a first pattern,
- each of the plurality of second chip regions has a second pattern,
- said second pattern is formed in an identical design pattern to said first pattern, and
- each of said first chip regions and said second chip regions has a rectangular shape when viewed two-dimensionally.
7 more elements
Dependencies are inferred from the claim text.