Layered substrate, light-emitting diode including the layered substrate and lighting device using the light-emitting diode

A layered substrate comprising:

• a first substrate including an upper surface, a lower surface, a peripheral surface between peripheral edges of the upper surface and the lower surface, and a cut portion cut into the peripheral surface and passing through the upper surface and the lower surface:
• and
• a second substrate including an upper surface, a lower surface, and a peripheral surface between peripheral edges of the upper surface and the lower surface, and the lower surface of the second substrate being layered on the upper surface of the first substrate and closing the cut portion of the first substrate from above.
• wherein the second substrate includes a heat conductor that can be thermally connected to an element to he mounted on the upper surface of the second substrate, the heat conductor being configured to thermally extend to the cut portion of the first substrate, and the second substrate further includede an upper electrode on the upper surface of the second substrate and a lower electrode on the lower surface of the second substrate, and
• wherein the lower electrode of the second substrate overlaps with the cut portion of the first substrate in a plan view.

A light-emitting diode comprising:

• a first substrate including an upper surface, a lower surface, a peripheral surface between peripheral edges of the upper surface and the lower surface, and a eut portion cut into the peripheral surface and passing;
• through the upper surface and the lower surface:
• a second substrate including an upper surface, a lower surface, and a peripheral surface between peripheral edges of the upper surface and the lower surface, and the lower surface of the second substrate being layered on the upper surface of the first substrate;
• and
• a light-emitting element mounted on the upper surface of the second substrate.
• the second substrate including a heat conductor that is a metal plate closing the cut portion of the first substrate from above, thermally connected to the light-emitting element mounted on the upper surface of the second substrate, and configured to thermally extend to the cut portion of the first subtrate.

A layered substrate comprising:

• a first substrate including an upper surface, a lower surface, a peripheral surface between peripheral edges of the upper surface and the lower surface, and a cut portion cut into the peripheral surface and passing through the upper surface and the lower surface;
• a second substrate including an upper surface, a lower surface, and a peripheral surface between peripheral edges of the upper surface and the lower surface, and the lower surface of the second substrate being layered on the upper surface of the first substrate;
• and
• the second substrate including a hsat conductor that can be thermally connected to an element to be mounted on the upper surface orthe second substrate, and the heat conductor is configured to thermally extend to the cut portion of the first substrate.
• the cut portion being a first cut portion, and the first substrate including a second cut portion smaller than the first cut portion in size and a third cut portion smaller than the first cut portion in size, and the second cut portion and the third cut portion being provided at corners of the first substrate with the first cut portion centered between the second cut portion and the third cut portion.