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US 8,618,562 B2Granted
Light emitting device and method for manufacturing same
AssigneeKabushiki Kaisha Toshiba
InventorYasuo Idei
Life of this patent
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Abstract
A light emitting device includes: a multilayer body including a light emitting layer made of a semiconductor; a first bonding metal layer attached to the multilayer body; a substrate; and a second bonding metal layer attached to the substrate and bonded to the first bonding metal layer at a bonding interface, at least one of a planar size of the first bonding metal layer on the bonding interface side and a planar size of the second bonding metal layer on the bonding interface side being smaller than a planar size of the substrate.
Claims18
A light emitting device comprising:
- a multilayer body made of a semiconductor and including a light emitting layer, the multilayer body having a first surface and a second surface opposed to the first surface;
- a first bonding metal layer attached to the multilayer body;
- a substrate having a first surface and a second surface opposed to the first surface of the substrate;
- and
- a second bonding metal layer attached to the substrate and bonded to the first bonding metal layer at a bonding interface,
- a planar size of a region of the first surface of the multilayer body to which the first bonding metal layer is attached being smaller than a planar size of the first surface of the multilayer body, or a planar size of a region of the first surface of the substrate to which the second bonding metal layer is attached smaller than a planar size of the first surface of the substrate,
- the substrate being made of one of Si, SiC, GaAs, and GaP, and
- the first bonding metal layer being formed in order of Au, AuZn, and Au from the multilayer body side.
5 more elements
A light emitting device comprising:
- a multilayer body made of a semiconductor and including a light emitting layer, the multilayer body having a first surface and a second surface opposed to the first surface;
- a first bonding metal layer attached to the multilayer body;
- a substrate having a first surface and a second surface opposed to the first surface of the substrate;
- and
- a second bonding metal layer attached to the substrate and bonded to the first bonding metal layer at a bonding interface,
- a planar size of a region of the first surface of the multilayer body to which the first bonding metal layer is attached being smaller than a planar size of the first surface of the multilayer body, or a planar size of a region of the first surface of the substrate to which the second bonding metal layer is attached being smaller than a planar size of the first surface of the substrate, and
- the bonding interface side of the first bonding metal layer or the bonding interface side of the second bonding metal layer being formed into a mesh or island configuration.
4 more elements
Dependencies are inferred from the claim text.