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US 8,618,422 B2Granted
Electronic component
AssigneeMurata Manufacturing Co., Ltd.
InventorsYasuo Fujii, Yoshinao Nishioka
Life of this patent
Estimating the term…
Abstract
A mounting structure includes an electronic component mounted on a circuit board. Land electrodes are disposed on a board body and are connected to outer electrodes of the electronic component through solders, respectively. A distance from each of the land electrodes to a top of the corresponding solder is not larger than about 1.27 times a distance from each of the land electrodes to an exposed portion of a capacitor conductor exposed at an end surface of the electronic component, the capacitor conductor being positioned closest to the circuit board.
Claims10
An electronic component comprising:
- a laminate including a plurality of laminated dielectric layers, the laminate including a bottom surface and a top surface opposed to each other and a first end surface and a second end surface opposed to each other;
- a plurality of capacitor conductors laminated together with the plurality of dielectric layers to form a capacitor, and led out to one of the first end surface and the second end surface;
- a first outer electrode disposed to extend over the first end surface and partially over the bottom surface, and connected to the plurality of capacitor conductors led out to the first end surface;
- and
- a second outer electrode disposed to extend over the second end surface and partially over the bottom surface, and connected to the plurality of capacitor conductors led out to the second end surface;
- wherein
- a distance between the bottom surface and a capacitor conductor of the plurality of capacitor conductors disposed closest to the bottom surface is greater than a distance between the top surface and a capacitor conductor of the plurality of capacitor conductors disposed closest to the top surface.
4 more elements
Dependencies are inferred from the claim text.