Topcoat composition, alkali developer-soluble topcoat film using the composition and pattern forming method using the same
AssigneeFUJIFILM Corporation
InventorShinichi Kanna
Life of this patent
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Abstract
A topcoat composition to be applied on a resist film is provided, the topcoat composition including: (A) an alkali-soluble resin; (B) a compound containing at least one of an Si atom and an F atom, and increasing a contact angle on a surface of the topcoat film; and (C) a solvent.
Claims30
A topcoat composition to be applied on a resist film to form a topcoat film, consisting essentially of:
- (A) an alkali-soluble resin;
- (B) a resin containing at least one of an Si atom and an F atom, and increasing the contact angle on a surface of the topcoat film;
- and
- (C) a solvent,
- wherein the receding contact angle of the topcoat film is 70° or more, and when the topcoat film is formed by adding the resin (B) in an amount of 1 part by mass based on 100 parts by mass of the total solid amount of the topcoat film but not including the solid amount of the resin (B), the resin (B) increases the receding contact angle of the topcoat film by 5.0% or more when compared with the receding contact angle of the topcoat film formed by the same topcoat composition except for not containing the resin (B).
A topcoat composition to be applied on a resist film to form a topcoat film, consisting essentially of:
- (A) an alkali-soluble resin;
- (B) a resin containing at least one of an Si atom and an F atom, and increasing the contact angle on a surface of the topcoat film;
- and
- (C) a solvent;
- wherein the receding contact angle of the topcoat film is 70° or more, and the addition amount of the resin (B) is 10 mass % or less based on the entire amount of solid contents of the topcoat composition.
A topcoat composition to be applied on a resist film to form a topcoat film, consisting essentially of:
- (A) an alkali-soluble resin;
- (B) a resin containing at least one of an Si atom and an F atom, and increasing the contact angle on a surface of the topcoat film;
- and
- (C) a solvent;
- wherein the topcoat film is soluble in an alkali developer and the receding contact angle of the topcoat film is 70° or more.
A pattern forming method, comprising:
- applying a topcoat composition on a resist film to form a topcoat film;
- and
- exposing and developing the resist film,
- wherein the topcoat composition consists essentially of:
- (A) an alkali-soluble resin;
- (B) a resin containing at least one of an Si atom and an F atom, and increasing the contact angle on a surface of the topcoat film;
- and
- (C) a solvent,
- wherein the receding contact angle of the topcoat film is 70° or more.
Dependencies are inferred from the claim text.