US 8,617,995 B2 · Manufacturing method of semiconductor device

Abstract

When a semiconductor device having a surface provided with a flexible protective material is manufactured, the misalignment of the protective material occurs at the time of disposing the protective material or performing adhesion treatment. In the case where the terminal portion over the substrate has a length X of 5 mm or less, by providing a step layer with a thickness of 0.38 X or more and 2 mm or less over the element portion, a space is formed between a surface of the terminal portion and the protective material even though the protective material disposed over the step layer so as to cover the element portion is overlapped with the terminal portion. By using an attaching member including an elastic material with a surface hardness of 50 or more and 100 or less in this state, the protective material and the substrate may be attached to each other.

Claims18

Dependent claims

A manufacturing method of a semiconductor device, comprising the steps of:

forming an element portion comprising a transistor over a substrate;
forming a terminal portion with a length X of 5 mm or less over the substrate;
forming a step layer with a thickness of 0.38 X mm or more and 2 mm or less over the element portion;
disposing a protective material having flexibility over the step layer so that the protective material covers the element portion;
and
adhering the protective material to the step layer by using an attaching member including an elastic material with a surface hardness of 50 or more and 100 or less.

3 more elements

Dependencies are inferred from the claim text.

Manufacturing method of semiconductor device

Life of this patent

Manufacturing method of semiconductor device

Life of this patent

Abstract

Claims18