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US 8,617,987 B2Granted
Through hole via filling using electroless plating
AssigneeStmicroelectronics Pte Ltd
InventorsKah Wee Gan, Yonggang Jin, Yun Liu, Yaohuang Huang
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Abstract
An embedded wafer level ball grid array (eWLB) is formed by embedding a semiconductor die in a molding compound. A trench is formed in the molding compound with a laser drill. A first layer of copper is deposited on the sidewall of the trench by physical vapor deposition. A second layer of copper is then formed on the first layer of copper by an electroless process. A third layer of copper is then formed on the second layer by electroplating.
Claims9
A method comprising:
- forming an aperture in a substrate;
- attaching an integrated circuit die to the substrate;
- depositing a first layer of conductive material in the aperture and on a contact pad of the integrated circuit die by physical vapor deposition;
- depositing a second layer of conductive material in the aperture and on the contact pad by electroless plating;
- and
- depositing a third layer of conductive material in the aperture and on the contact pad by electroplating.
3 more elements
A method comprising:
- attaching a first integrated circuit die to a substrate;
- forming an aperture in a substrate;
- forming a first layer of copper in the aperture and on a contact pad of the integrated circuit die;
- forming a second layer of copper in the aperture and on the contact pad;
- forming a third layer of copper in the aperture and on the contact pad;
- placing a first solder ball on over a first surface of the substrate;
- and
- electrically connecting the solder ball to the first layer of copper.
5 more elements
Dependencies are inferred from the claim text.