Methods of forming diodes

A method of forming a plurality of diodes, comprising:

• forming a carbon-containing sacrificial material over a first conductive material;
• forming a dielectric material over the sacrificial material;
• forming silicon-containing support structures adjacent the dielectric material;
• and
• after forming the support structures, removing an entirety of the sacrificial material from over the conductive material.

A method of forming a plurality of diodes, comprising:

• forming a first conductive material over a semiconductor substrate;
• forming a structure over the first conductive material, the structure comprising supports interspersed in sacrificial material and being formed by self-assembly of block copolymer;
• forming overlying materials across the structure, the overlying materials including at least one dielectric material, and a second conductive material over the at least one dielectric material;
• patterning the structure and overlying materials into a plurality of spaced-apart features;
• removing an entirety of the sacrificial material while leaving the supports to at least partially support the overlying materials;
• and
• wherein the features having the sacrificial material removed therefrom, together with the first conductive material, comprise a plurality of diodes.

A method of forming a plurality of diodes, comprising:

• forming a first conductive material over a semiconductor substrate;
• forming a plurality of spaced-apart metal-containing particles over the first conductive material;
• forming a substance over and between the spaced-apart particles, the substance comprising oxygen or silicon;
• chemically modifying at least the outer surfaces of the particles by reaction of said outer surfaces with the substance;
• forming materials overlying the substance, the overlying materials including at least one dielectric material, and a second conductive material over the at least one dielectric material;
• removing an entirety of the substance to leave the chemically-modified particles to at least partially support the overlying materials;
• patterning the overlying materials into a plurality of spaced apart features;
• and
• wherein the features, together with the first conductive material, comprise a plurality of diodes.