Methods of manufacture of top port multi-part surface mount silicon condenser microphone packages

A method of manufacturing a plurality of solder reflow surface mount microelectromechanical system (MEMS) microphone devices, the method comprising:

• providing an unsingulated panel comprised of a plurality of individual bottom portions, each bottom portion comprising multiple layers of non-conductive material and having a planar upper surface and a planar lower surface, the upper surface having an interior region and a peripheral region that completely surrounds the interior region, each individual bottom portion further comprising:
• a first plurality of metal pads disposed on the upper surface of the individual bottom portion;
• a second plurality of metal pads disposed on the lower surface of the individual bottom portion and arranged within a perimeter of the lower surface of the individual bottom portion, wherein the second plurality of metal pads are configured to mechanically attach and electrically couple the surface mount MEMS microphone device to pads on a surface of an external printed circuit board;
• and
• one or more electrical pathways disposed completely within the individual bottom portion, wherein the pathways electrically couple one or more of the first plurality of metal pads on the upper surface of the individual bottom portion to one or more of the second plurality of metal pads on the lower surface of the individual bottom portion;
• providing an unsingulated panel comprised of a plurality of individual top portions, each top portion having an upper surface and a planar lower surface, the lower surface of each top portion having an interior region and a peripheral region that completely surrounds the interior region of the top portion, the top portion further comprising an acoustic port disposed in the interior region of the top portion and passing through the top portion;
• providing an unsingulated panel comprised of a plurality of individual sidewall portions, wherein each sidewall portion has a top surface and a bottom surface, and is comprised of at least one layer of non-conductive material having a predefined thickness, and wherein at least a portion of the top surface of each sidewall portion is coated with conductive material, and each sidewall portion further comprises an opening having walls that extend between the top surface and the bottom surface of the sidewall portion;
• mounting a MEMS microphone die on the upper surface of each bottom portion in the unsingulated panel of bottom portions;
• electrically coupling each MEMS microphone die to at least one of the first plurality of metal pads on the upper surface of its respective bottom portion;
• mechanically attaching the unsingulated panel of bottom portions, the unsingulated panel of sidewall portions and the unsingulated panel of top portions to each other in a predetermined order, wherein the interior region of the upper surface of each bottom portion, the walls of the opening of its respective sidewall portion, and the interior region of the lower surface of its respective top portion, when attached, define an acoustic chamber that surrounds its respective MEMS microphone die;
• and
• singulating the attached panels into a plurality of individual MEMS microphone devices, wherein the respective top portion, sidewall portion, and bottom portion of each MEMS microphone device form a housing after singulation of the attached panels, wherein the housing has surfaces substantially perpendicular to the lower surface of the bottom portion.

A method of manufacturing a plurality of solder reflow surface mount microelectromechanical system (MEMS) microphone devices, the method comprising:

• providing an unsingulated panel comprised of a plurality of individual substrates, each substrate comprising multiple layers of non-conductive material and having a planar upper surface and a planar lower surface, the upper surface having an interior region and a peripheral region that completely surrounds the interior region, each individual substrate further comprising:
• a first plurality of metal pads disposed on the upper surface of the individual substrate;
• a second plurality of metal pads disposed on the lower surface of the individual substrate and arranged within a perimeter of the lower surface of the individual substrate, wherein the second plurality of metal pads are configured to mechanically couple and electrically couple the surface mount MEMS microphone device to pads on a surface of an external printed circuit board;
• and
• one or more electrical pathways disposed completely within the individual substrate, wherein the pathways electrically couple one or more of the first plurality of metal pads on the upper surface of the individual substrate to one or more of the second plurality of metal pads on the lower surface of the individual substrate;
• providing an unsingulated panel comprised of a plurality of individual lids, each lid having an upper surface and a planar lower surface, the lower surface of each lid having an interior region and a peripheral region that completely surrounds the interior region of the lid, the lid further comprising an acoustic port disposed in the interior region of the lid and passing through the lid;
• providing an unsingulated panel comprised of a plurality of individual sidewall spacers, wherein each sidewall spacer has a top surface and a bottom surface, and is comprised of at least one layer of non-conductive material having a predefined thickness, and wherein at least a portion of the top surface of each sidewall spacer is coated with conductive material, and each sidewall spacer further comprises a window having walls that extend between the top surface and the bottom surface of the sidewall spacer;
• physically coupling a MEMS microphone die on the upper surface of each substrate in the unsingulated panel of substrates;
• electrically coupling each MEMS microphone die to at least one of the first plurality of metal pads on the upper surface of its respective substrate;
• physically coupling the unsingulated panel of substrates, the unsingulated panel of sidewall spacers and the unsingulated panel of lids to each other in a predetermined order, wherein the interior region of the upper surface of each substrate, the walls of the window of its respective sidewall spacer, and the interior region of the lower surface of its respective lid, when coupled, define an acoustic chamber that surrounds its respective MEMS microphone die;
• and
• singulating the coupled panels into a plurality of individual MEMS microphone devices, wherein the respective lid, sidewall spacer, and substrate of each MEMS microphone device form a housing after singulation of the coupled panels, wherein the housing has surfaces substantially perpendicular to the lower surface of the substrate.

A method of manufacturing a plurality of solder reflow surface mount microelectromechanical system (MEMS) microphone devices, the method comprising:

• providing an unsingulated panel comprised of a plurality of individual printed circuit boards, each printed circuit board having a multi-layer core of conductive and non-conductive materials, wherein the printed circuit board has a planar upper surface and a planar lower surface, the upper surface having an interior region and a peripheral region that completely surrounds the interior region, each individual printed circuit board further comprising:
• a first metal layer disposed on the upper surface of the printed circuit board and patterned into a first plurality of metal pads, wherein at least one pad of the first plurality of metal pads is disposed in the peripheral region of the upper surface of the individual printed circuit board;
• a second metal layer disposed on the lower surface of the printed circuit board and patterned into a second plurality of metal pads, the second plurality of metal pads arranged within a perimeter of the lower surface of the individual printed circuit board, wherein the second plurality of metal pads are configured to mechanically couple and electrically couple the surface mount MEMS microphone device to pads on a surface of an external printed circuit board;
• and
• one or more electrical pathways disposed completely within the individual printed circuit board, wherein the pathways electrically couple one or more of the first plurality of metal pads on the upper surface of the individual printed circuit board to one or more of the second plurality of metal pads on the lower surface of the individual printed circuit board;
• providing an unsingulated panel comprised of a plurality of individual top portions, each top portion having an upper surface and a planar lower surface, the lower surface of each top portion having an interior region and a peripheral region that completely surrounds the interior region of the top portion, the top portion further comprising an acoustic port disposed in the interior region of the top portion and passing through the top portion, wherein at least a portion of the lower surface of each top portion is coated with conductive material;
• providing an unsingulated panel comprised of a plurality of individual sidewall portions, wherein each sidewall portion has a top surface and a bottom surface, and is comprised of at least one layer of non-conductive material having a predefined thickness, and wherein at least a portion of the top surface of each sidewall portion is coated with conductive material, and each sidewall portion further comprises an opening having walls that extend between the top surface and the bottom surface of the sidewall portion;
• physically coupling a MEMS microphone die on the upper surface of each individual printed circuit board in the unsingulated panel of individual printed circuit boards;
• electrically coupling each MEMS microphone die to at least one of the first plurality of metal pads on the upper surface of its respective printed circuit board;
• physically coupling the unsingulated panel of printed circuit boards, the unsingulated panel of sidewall portions and the unsingulated panel of top portions to each other in a predetermined order, wherein the interior region of the upper surface of each printed circuit board, the walls of the opening of its respective sidewall portion, and the interior region of the lower surface of its respective top portion, when coupled, define an acoustic chamber that surrounds its respective MEMS microphone die;
• and
• singulating the coupled panels into a plurality of individual MEMS microphone devices, wherein the respective top portion, sidewall portion, and printed circuit board of each MEMS microphone device form a housing after singulation of the coupled panels wherein the housing has surfaces substantially perpendicular to the lower surface of the printed circuit board.