Dicing/die bonding film

A method of manufacturing a semiconductor device using a dicing die-bonding film comprising a dicing film having a pressure-sensitive adhesive layer on a substrate material, and a die-bonding film formed on the pressure-sensitive adhesive layer, the method comprising:

• preparing the dicing die-bonding film in which the pressure-sensitive adhesive layer contains a polymer including an acrylic acid ester as a main monomer, 10 to 40 mol % of a hydroxyl group-containing monomer based on the acrylic acid ester, and 70 to 90 mol % of an isocyanate compound having a radical reactive carbon-carbon double bond based on the hydroxyl group-containing monomer, and is also cured by irradiation with ultraviolet rays under predetermined conditions, and wherein the die-bonding film contains an epoxy resin, and is also bonded on the pressure-sensitive adhesive layer after irradiation with ultraviolet rays;
• pressure-bonding a semiconductor wafer on the die-bonding film;
• dicing the semiconductor wafer together with the die-bonding film to form a semiconductor chip;
• and
• peeling the semiconductor chip from the pressure-sensitive adhesive layer together with the die-bonding film;
• wherein
• the step of pressure-bonding of the semiconductor wafer to the step of peeling the semiconductor chip are conducted without irradiating the pressure-sensitive adhesive layer with ultraviolet rays.