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US 8,617,927 B1Granted
Method of mounting electronic chips
AssigneeHRL Laboratories, LLC
InventorsAlexandros D. Margomenos, Miroslav Micovic
Life of this patent
Estimating the term…
Abstract
A method and apparatus for mounting microelectronic chips to a thermal heat sink. The chips are arranged in a desired configuration with their active faces all facing a common direction and with their active faces defining a common planar surface for all of said chips. A metallic material is applied to the chip, preferably by electroplating to backsides of the chips, the metallic material being electro-formed thereon and making void-free contact with the backsides of the chips.
Claims27
A method of mounting a plurality of semiconductor or microelectronic chips, comprising:
- i. providing a carrier;
- ii. temporarily adhering said plurality of semiconductor or microelectronic chips to said carrier with active faces of said chips facing towards said carrier;
- iii. covering backsides of said chips and filling empty spaces between said chips with a metallic material to thereby define an assembly of said chips and said metallic material;
- and
- vi. releasing the assembly from said carrier.
2 more elements
A method of mounting a plurality of semiconductor or microelectronic chips, comprising:
- i. providing a carrier;
- ii. temporarily adhering a support material to said carrier using an adhesive;
- iii. forming chip-receiving openings in said support material, said chip-receiving openings completely penetrating said support material;
- iv. disposing said plurality of semiconductor or microelectronic chips in said openings, with one or more ones of said semiconductor or microelectronic chips in each of said chip-receiving openings and with active faces of said chips facing towards said carrier;
- v. filling empty spaces around said chips in said openings and between said chips and walls of said openings with a metallic material to thereby define an assembly of said support material, said chips and said metallic material;
- vi. releasing the assembly from said carrier;
- and
- vii. forming a pattern of interconnections between the active faces of the chips.
5 more elements
A method of mounting a plurality of semiconductor or microelectronic chips, comprising:
- i. providing a carrier;
- ii. temporarily adhering a support material to said carrier using an adhesive;
- iii. forming chip-receiving openings in said support material, said chip-receiving openings completely penetrating said support material;
- iv. disposing said plurality of semiconductor or microelectronic chips in said openings, with one or more ones of said semiconductor or microelectronic chips in each of said chip-receiving openings and with active faces of said chips facing towards said carrier;
- v. filling empty spaces around said chips in said openings and between said chips and walls of said openings with a metallic material to thereby define an assembly of said support material, said chips and said metallic material;
- vi. releasing the assembly from said carrier;
- and
- vii. forming a pattern of interconnections between the active faces of the chips;
- wherein said chips have non-uniform thicknesses and differences in substrate thicknesses of said plurality of chip are absorbed by planarizing the metallic material, the planarized metallic material providing, in use, a heat sink for each of said plurality of chips.
6 more elements
A method of mounting chips to a thermal heat sink comprising:
- disposing the chips in a desired configuration with their active or frontside faces all facing a common direction and with their active or frontside faces defining a common planar surface for all of said chips;
- forming a metallic seed material on backsides of said chips, the metallic seed material making void-free contact with the backsides of the chips;
- and
- disposing the thermal heat sink on the seed metallic material which was formed on the backsides of the chips and also disposing the thermal heat sink in spaces between the chips and on sidewalls of the chips.
1 more element
A method of mounting a plurality of semiconductor or microelectronic chips, comprising:
- i. providing a carrier;
- ii. temporarily adhering said plurality of semiconductor or microelectronic chips to said carrier with active faces of said chips facing towards said carrier;
- iii. covering backsides of said chips and filling empty spaces between adjacent chips with an integral metallic material applied by a metal deposition process to thereby define an assembly of said chips and said metallic material;
- vi. releasing the assembly from said carrier;
- and
- vii. forming a pattern of interconnections between the active faces of the chips.
3 more elements
A method of mounting a plurality of semiconductor or microelectronic chips, comprising:
- i. providing a carrier;
- ii. applying a temporary adhesive layer to said carrier;
- iii. temporarily adhering a support material to said adhesive layer, the support material having chip-receiving openings therein, said chip-receiving openings completely penetrating said support material;
- iv. disposing said plurality of semiconductor or microelectronic chips in said openings in said support material, with one or more ones of said semiconductor or microelectronic chips in each of said chip-receiving openings and with active faces of said chips facing towards said carrier;
- v. filling empty spaces around said chips in said openings and between said chips and walls of said openings in said support material with a metallic material to thereby define an assembly of said support material, said chips and said metallic material;
- vi. releasing the assembly from said carrier and from said support material;
- and
- vii. forming a pattern of interconnections between the active faces of the chips.
5 more elements
Dependencies are inferred from the claim text.