Stacked integrated circuit package-in-package system and method of manufacture thereof

A method of manufacturing a stacked integrated circuit package-in-package comprising:

• forming a laminate substrate with a first top contact and a second top contact;
• mounting a first device having a first terminal and a first device encapsulation over the substrate, wherein the first terminal is directly above the first top contact;
• stacking a second device having a second terminal and a second device encapsulation over the first device in an offset configuration, wherein the second terminal is directly above the second top contact;
• connecting a first internal interconnect between the first terminal and the first top contact directly below the first terminal;
• and
• connecting a second internal interconnect including a solder ball between the second terminal and the second top contact directly below the second terminal.

A stacked integrated circuit package-in-package comprising:

• a substrate with a first top contact and a second top contact;
• a first device having a first terminal over the substrate, wherein the first terminal is directly above the first top contact;
• a second device having a second terminal over the first device in an offset configuration, wherein the second terminal is directly above the second top contact;
• a first internal interconnect between the first terminal and the first top contact directly below the first terminal;
• and
• a second internal interconnect including a solder ball between the second terminal and the second top contact directly below the second terminal.