Display device and a method of manufacturing the same

A method of manufacturing a display device, the method comprising:

• forming a plurality of first signal pads and a first dummy pad disposed adjacent to the first signal pads on a first base substrate to form an array substrate;
• forming an adhesive on the first signal pads and the first dummy pad;
• and
• disposing a driving film including a base film, a plurality of output terminals formed on the base film and a first alignment mark formed adjacent to the output terminals on the base film, and adhering the output terminals and the first alignment mark to the first signal pads and the first dummy pad, respectively,
• wherein the first dummy pad overlaps with the first alignment mark, and wherein the first alignment mark includes at least one alignment portion defining an alignment groove on the driving film.

A display device comprising:

• an array substrate comprising a first base substrate, a plurality of first signal pads and a first alignment mark disposed on the first base substrate and a first dummy pad disposed outside of the first signal pads and adjacent to the first alignment mark;
• a printed circuit board (PCB);
• a driving film disposed between the array substrate and the PCB and which electrically connects the array substrate to the PCB, the driving film comprising a base film including a first overlap area which overlaps the array substrate and a second overlap area spaced apart from the first overlap area and which overlaps the PCB, a plurality of output terminals and a plurality of input terminals disposed on the first overlap area and the second overlap area of the base film, respectively, a driving chip disposed between the first and second overlap areas and electrically connected to the output terminals and the input terminals and a second alignment mark disposed adjacent to the output terminals in the first overlap area;
• and
• an adhesive member disposed between the array substrate and the driving film adhering the first signal pads and the first dummy pad of the array substrate to the output terminals and the second alignment mark of the driving film, respectively and disposed between the PCB and the driving film adhering the driving film to the PCB,
• wherein the first dummy pad overlaps with the second alignment mark, and wherein the second alignment mark includes at least one alignment portion defining an alignment groove on the driving film.