LED with substrate modifications for enhanced light extraction and method of making same
AssigneeCree, Inc.
InventorsMax Batres, James Ibbetson, Ting Li, Adam W. Saxler
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AssigneeCree, Inc.
InventorsMax Batres, James Ibbetson, Ting Li, Adam W. Saxler
Estimating the term…
The surface morphology of an LED light emitting surface is changed by applying a reactive ion etch (RIE) process to the light emitting surface. Etched features, such as truncated pyramids, may be formed on the emitting surface, prior to the RIE process, by cutting into the surface using a saw blade or a masked etching technique. Sidewall cuts may also be made in the emitting surface prior to the RIE process. A light absorbing damaged layer of material associated with saw cutting is removed by the RIE process. The surface morphology created by the RIE process may be emulated using different, various combinations of non-RIE processes such as grit sanding and deposition of a roughened layer of material or particles followed by dry etching.
A method of fabricating a light emitting diode (LED) including a growth substrate having a light emitting surface, said method comprising:
A method of fabricating an LED including a growth substrate and an epitaxial light emitting region, said growth substrate comprising a primary light emitting surface having at least one cut surface to increase light extraction with a light absorbing damaged layer of material and a light emission region on a surface of the substrate opposite the light emitting surface, said method comprising:
Dependencies are inferred from the claim text.