Bonding of substrates including metal-dielectric patterns with metal raised above dielectric and structures so formed

A structure comprising:

• a first substrate having a metal-dielectric pattern on a surface thereof, the metal-dielectric pattern including:
• a metal having a concave upper surface;
• and
• a dielectric having a substantially uniform upper surface,
• wherein the metal on the first substrate is raised above the dielectric on the first substrate;
• and
• a second substrate bonded with the first substrate, the second substrate including:
• a dielectric;
• and
• a metal positioned substantially below the dielectric of the second substrate,
• wherein the metal positioned substantially below the dielectric of the second substrate is wider than the metal on the first substrate that is raised above the dielectric on the first substrate,
• wherein the first substrate and the second substrate are bonded at the metal from the first substrate and the metal from the second substrate.