Electrically conductive polymeric compositions, contacts, assemblies and methods
AssigneeHeraeus Precious Metals North America Conshohocken LLC
InventorsHong Jiang, Aziz S. Shaikh
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Abstract
Electrically conductive polymeric compositions adapted for use in forming electronic devices are disclosed. The compositions are thermally curable at temperatures less than about 250° C. Compositions are provided which may be solvent-free and so can be used in processing or manufacturing operations without solvent recovery concerns. The compositions utilize (i) fatty acid modified epoxy acrylate and/or methacrylate monomer(s) and/or oligomer(s), (ii) fatty acid modified polyester acrylate and/or methacrylate monomer(s) and/or oligomer(s), or combinations of (i) and (ii). Also described are electronic assemblies such as solar cells using the various compositions and related methods.
Claims15
An electrically conductive, thermally curable composition comprising:
- from about 70% to about 90% by weight of electrically conductive silver particles;
- and
- from about 0.1% to about 30% by weight of a selection from the group consisting of (i) fatty acid modified epoxy acrylate and/or methacrylate monomer(s) or oligomer(s), (ii) fatty acid modified polyester acrylate and/or methacrylate monomer(s) or oligomer(s), and (iii) combinations of (i) and (ii);
- wherein the composition is solvent-free and in the form of a paste that can be screen printed onto a substrate and thereafter cured at a temperature of less than 250° C. to form an electrically conductive contact, trace, circuit and/or other electrically conductive region.
Dependencies are inferred from the claim text.