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US 8,617,410 B2Granted
Method and system for wafer inspection
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChang-Cheng Hung, Tsai-Sheng Gau
Life of this patent
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Abstract
A method for inspecting semiconductor wafers patterned by a photomask includes loading a first wafer and scanning a first image of the first wafer, loading a second wafer and scanning a second image of the second wafer, comparing the first and second images, and classifying a difference detected between the first and second images as a potential defect on the photomask. The potential defect includes a haze defect on the photomask.
Claims16
A system for inspecting wafers patterned by a photomask, the system comprising:
- a wafer inspector operable to generate a first image of a first wafer and a second image of a second wafer;
- and
- a comparator configured to detect a difference between the first and second images to determine whether a potential defect exists on the photomask and classify the difference between the first and second images as a potential defect on the photomask if the difference detected between the first and second images is equal to or greater than a predetermined value.
A system comprising:
- a scanning device operable to generate a first image of a first wafer and a second image of a second wafer;
- and
- a comparator configured to detect a difference between the first and second images to determine whether a potential defect exists on a photomask and classify the difference between the first and second images as a potential defect on the photomask.
Dependencies are inferred from the claim text.