Integrated apparatus to assure wafer quality and manufacturability

A system comprising:

• a central transfer chamber;
• a plurality of process modules disposed proximate to the central transfer chamber wherein each of the plurality of process modules is operable to perform a semiconductor device fabrication process;
• a load lock chamber connected to the central transfer chamber, wherein a first end of the load lock chamber is connected to the central transfer chamber;
• and
• a load lock interface connected to the load lock chamber, wherein the load lock interface is connected to the load lock chamber at a second end, the second end opposing the first end, and wherein the load lock interface includes:
• an equipment front end module (EFEM) chamber, wherein the EFEM chamber includes a load lock transfer mechanism operable to transfer the substrate from a load port to the load lock chamber;
• the load port connected to the EFEM chamber;
• a transport carrier docked in the load port;
• a measurement instrument operable to measure a level of contaminants in the transport carrier;
• a gas delivery apparatus disposed in the load lock interface, wherein the gas delivery apparatus has a gas inlet nozzle on disposed on a first edge of a substrate upon which the semiconductor device fabrication process is performed and a gas outlet nozzle disposed on a second, opposing edge of the substrate, the first and second edge being separated by a diameter of the substrate;
• and a load lock module connected to the EFEM chamber and having a physical barrier separating the load lock module and the EFEM chamber, wherein the load lock module includes the gas delivery apparatus.