Sensor module and sensor module manufacturing method
AssigneeCIS Eletronica Industria e Comercio Ltda.
InventorYasuo Isuyama
Life of this patent
Estimating the term…
Abstract
Provided is a sensor module capable of ensuring security of data in which card data output from a magnet head is not stolen by a third party. In a sensor module 10A, a front-end portion of a flexible substrate 13 to which a connection terminal, a resistive element, an A/D conversion chip, and a digital IC are attached is accommodated in a housing 11 with a predetermined capacity in a state of being folded into four in one direction and the connection terminal, the resistive element, the A/D conversion chip, and the digital IC are fixed to the housing 11 together with the front-end portion of the flexible substrate 13 by means of epoxy resin filled in the housing 11.
Claims3
A sensor module, comprising:
- a flexible substrate extending in one direction;
- a signal processing device installed on a front-end portion of the flexible substrate;
- and a sensor element for converting a measured volume from a measuring target to an analog signal, the signal processing device including a connection terminal connected to the sensor element for receiving the analog signal output from the sensor element, an A/D conversion chip connected to the connection terminal for converting the analog signal received by the connection terminal from the sensor element to a digital signal, and a digital IC connected to the A/D conversion chip for encrypting the digital signal output from the A/D conversion chip,
- wherein the connection terminal, the A/D conversion chip, and the digital IC are installed on the front-end portion of the flexible substrate in a state of being arranged in the one direction, and the front-end portion of the flexible substrate is folded between the connection terminal and the A/D conversion chip and is accommodated in a housing with a predetermined capacity in a state of being folded between the connection terminal and the A/D conversion chip, and the connection terminal, the A/D conversion chip, the digital IC, and the front-end portion of the flexible substrate are fixed to the housing by means of a solidification substance filled in the housing.
Dependencies are inferred from the claim text.