Finger sensing device including finger sensing integrated circuit die within a recess in a mounting substrate and related methods

A finger sensing device comprising:

• a mounting substrate having a recess in a top surface thereof and having a plurality of conductive through-vias extending from the top surface to a bottom surface, said conductive through-vias being laterally adjacent to the recess;
• a finger sensing integrated circuit (IC) die within the recess and comprising a finger sensing area on a top surface thereof and a plurality of bond pads on the top surface laterally adjacent said finger sensing area, the top surface being flush with the top surface of said mounting substrate;
• a dielectric layer over said mounting substrate and said finger sensing IC die;
• a conductive pattern carried by said dielectric layer and coupling said plurality of conductive through-vias to respective ones of said plurality of bond pads;
• and
• a respective conductive via coupling each of said plurality of bond pads and an adjacent portion of said conductive pattern.

A method of making a finger sensing device comprising:

• forming a mounting substrate having a recess in a top surface thereof and having a plurality of conductive through-vias extending from the top surface to a bottom surface, the conductive through-vias being laterally adjacent to the recess;
• positioning a finger sensing integrated circuit (IC) die within the recess and comprising a finger sensing area on a top surface thereof and a plurality of bond pads on the top surface laterally adjacent the finger sensing area;
• positioning a dielectric layer over the mounting substrate and the finger sensing IC die, the dielectric layer carrying a conductive pattern;
• and
• coupling a conductive pattern to the plurality of conductive through-vias and to respective ones of the plurality of bond pads.