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US 8,616,372 B2Granted
Recyclable blister pack and process of making
AssigneeQuality Packaging, Inc.
InventorKenneth Raymond Wills
Life of this patent
Estimating the term…
Abstract
A recyclable blister pack system is provided, including a substrate having a dry tack cohesive adhesive layer deposited on one of its surfaces and a blister layer for receiving a product. The properties of the dry tack cohesive are selected so the blister layer is separable from the substrate without leaving substantial substrate residue on the blister layer. This improves the recyclability of the blister layer.
Claims20
A tamper-resistant, multi-piece package comprising:
- a planar, fibrous substrate comprising:
- an unprinted side;
- a printed side opposite the unprinted side;
- a centerline configured to facilitate folding, dividing the fibrous substrate into a first region and a second region;
- and
- a first opening passing through the second region;
- a dry-tack coadhesive layer having first and second opposing portions located on opposing unprinted sides of both the first and second regions, respectively, wherein the dry-tack coadhesive is an aqueous material that is configured to dry as a coadhesive after application to the substrate;
- and
- a blister layer configured to accept a product, wherein the blister layer includes a peripheral section;
- wherein the first and second opposing portions of the dry-tack coadhesive layer are brought together by folding the substrate along the centerline sealing the opposing portions of the dry-tack coadhesive layer to each other;
- wherein the peripheral section of the blister layer is captured between the opposing portions of the dry-tack coadhesive layer without the dry-tack coadhesive adhering to the blister layer.
8 more elements
A package comprising:
- a fibrous substrate comprising:
- an unprinted side;
- a printed side opposite the unprinted side;
- a hinge configured to facilitate folding, dividing the fibrous substrate into a first region and a second region;
- and
- an opening passing through the second region;
- wherein the material of the fibrous substrate is at least one of a corrugated material or a chipboard material;
- a dry-tack coadhesive layer having first and second opposing portions deposited on opposing unprinted sides of both the first and second regions of the fibrous substrate, respectively, wherein the dry-tack coadhesive is an aqueous material that is configured to dry as a coadhesive after application to the substrate, wherein the dry-tack coadhesive layer is a uniform layer on the unprinted surface of the substrate;
- and
- a blister layer configured to accept a product, wherein the blister layer includes a peripheral section;
- wherein the first and second opposing portions of the dry-tack coadhesive layer are positioned such that folding the substrate along the hinge brings the opposing portions of the dry-tack coadhesive layer into contact with each other to form a bond;
- wherein the peripheral section of the blister layer is captured between the opposing portions of the dry-tack coadhesive layer.
9 more elements
Dependencies are inferred from the claim text.