Mechanically compliant thermal spreader with an embedded cooling loop for containing and circulating electrically-conductive liquid

A thermal spreader, comprising:

• a mechanically flexible substrate, the mechanically flexible substrate forming an internal channel, the internal channel being configured for containing an electrically-conductive liquid, the internal channel being further configured to allow for closed-loop flow of the electrically-conductive liquid within the internal channel, the mechanically flexible substrate including a surface configured for contacting the electrically-conductive liquid, said surface of the mechanically flexible substrate being coated with alkali silicate glass, at least a portion of the mechanically flexible substrate being constructed of an organic material;
• a pump, the pump configured for being connected to the mechanically flexible substrate, the pump being further configured for circulating the electrically-conductive liquid within the internal channel;
• and
• a rigid metal insert, the rigid metal insert configured for being integrated with the mechanically flexible substrate, the rigid metal insert being further configured for promoting thermal energy transfer to the electrically-conductive liquid and for promoting thermal energy transfer from the electrically-conductive liquid, said rigid metal insert including a surface configured for contacting the electrically-conductive liquid, said surface of the rigid metal insert being coated with alkali silicate glass
• wherein the thermal spreader is configured for being connected to a heat source and a heat sink, the thermal spreader being further configured for directing thermal energy from the heat source to the heat sink via the electrically-conductive liquid.

A method for providing a thermal spreader, said method comprising:

• fabricating a mechanically flexible substrate, said mechanically flexible substrate forming an internal channel configured for containing and allowing closed-loop flow of electrically-conductive liquid, at least a portion of the mechanically flexible substrate being constructed of an organic material;
• integrating a pump with the mechanically flexible substrate, said pump configured for circulating the electrically-conductive liquid within the internal channel;
• and fabricating a plurality of rigid metal inserts, each rigid metal insert configured for being integrated with the mechanically flexible substrate for promoting the transfer of thermal energy both to and from the electrically conductive liquid;
• forming a plurality of extension portions on a surface of each rigid metal insert included in the plurality of rigid metal inserts, said extension portions configured for promoting thermal energy transfer between the rigid metal insert and the electrically-conductive liquid;
• connecting the plurality of rigid metal inserts to the mechanically flexible substrate;
• coating a metal portion of an electrically-conductive liquid contact surface of the mechanically flexible substrate with a layer of alkali silicate glass;
• and
• coating an electrically-conductive liquid contact surface of each rigid metal insert with a layer of alkali silicate glass,
• wherein the thermal spreader is configured for being connected to a heat source and a heat sink, the thermal spreader being further configured for directing thermal energy from the heat source to the heat sink via the electrically-conductive liquid.