Chip mounted wiring substrate

A chip mounted circuit substrate comprising:

• a plurality of wiring electrodes arranged on a base film at a first pitch in a first direction;
• and
• two of first positioning marks formed at both sides of an arrangement of the wiring electrodes in the first direction, wherein
• in a state before installing the chip mounted circuit substrate on a liquid crystal display panel by thermo-compression bonding,
• the first pitch of the arrangement of the wiring electrodes is selected to be narrower than a second pitch of the arrangement of the wiring electrodes after installing the chip mounted circuit substrate on the liquid crystal display panel by thermo-compression bonding in consideration with expansion of the base film in the first direction due to the thermo-compression bonding,
• the first positioning marks are formed so that a part of each the first positioning mark overlaps a second positioning mark formed on the liquid crystal display panel and protrudes outward from the second positioning mark in the first direction, and
• the portions of the first positioning marks protruding from the second positioning marks are formed to have stepped shapes so that distances in a second direction perpendicular to the first direction between opposing two sides of the stepped shapes in parallel with the first direction become shorter in phase and each step of the stepped shapes is formed at a third pitch in the first direction.