Dual level contact design for an interconnect system in power applications
AssigneeInternational Business Machines Corporation
InventorEric N. Phan
Life of this patent
Estimating the term…
Loading patent…
AssigneeInternational Business Machines Corporation
InventorEric N. Phan
Estimating the term…
Various embodiments provide an interconnect system for power applications. The interconnect system includes a receptacle comprising a first conductive wall. At least a second conductive wall is situated opposite the first conductive wall. The receptacle further includes a first end and a second end situated opposite the first end. A first sacrificial contact area is situated on the first conductive wall. At least a second sacrificial contact area is situated on the second conductive wall. A first conductive contact area is situated on the first conductive wall. At least a second conductive contact area is situated on the second conductive wall. The conductive contact areas are situated closer to the first end than the sacrificial contact areas. The sacrificial contact areas are configured to contact a sacrificial portion of the header prior to a conductive portion of the header contacting the conductive contact areas of the receptacle.
A receptacle for a power interconnect system comprising:
A header for a power interconnect system comprising:
An interconnect system for power applications, the interconnect system comprising:
An interconnect system for power applications, the interconnect system comprising:
Dependencies are inferred from the claim text.