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US 8,580,073 B2Granted
Hot melt adhesive compositions and methods for their preparation and use
AssigneeDow Corning Corporation
InventorsDaniel Behl, Glen Gordon, Loren Lower, Ross Noel
Life of this patent
Estimating the term…
Abstract
A hot melt adhesive composition can be used to laminate substrates together in construction industry and industrial maintenance and assembly applications. The hot melt adhesive composition is sprayable to form a thin layer (1 to 200 microns in thickness) on a substrate. The hot melt adhesive can cure by exposure to moisture or harden by cooling, or a combination thereof.
Claims25
A process for preparing a laminate article comprises:
- (i) applying by spraying or fiberizing, onto a first substrate, a hot melt adhesive composition having a viscosity ranging from 5,000 to 30,000 mPa·s at 125° C., where the hot melt adhesive composition comprises:
- (1) 55 to 62 parts of a silicone resin having a silicon-bonded hydroxyl group content of less than 0.7 wt % based on the total weight of the silicone resin and comprising monofunctional units represented by R13SiO1/2 and tetrafunctional units represented by SiO4/2 where R1 is a substituted or unsubstituted monovalent hydrocarbon radical,
- (2) 38 to 45 parts of an organopolysiloxane comprised of difunctional units of the formula R2R3SiO and terminal units of the formula R4aX′3-aSiG— wherein R2 is an alkoxy group or a monovalent unsubstituted or substituted hydrocarbon radical;
- R3 is a monovalent unsubstituted or substituted hydrocarbon radical;
- R4 is aminoalkyl or R1 group, X′ is a hydrolyzable group;
- G is an oxygen atom or a divalent group linking the silicon atom of the terminal unit with another silicon atom and a is 0 or 1,
- (3) 0.1 to 5 parts of a silane crosslinker per hundred per part of silicone resin and organopolysiloxane, and
- (4) 0.02 to 2 parts of a titanate catalyst per hundred per part of silicone resin and organopolysiloxane;
- with the provisos that the hot melt adhesive composition is free of filler and the hot melt adhesive composition has a nonvolatile content of 97.5% to 100%, thereby forming a film;
- (ii) contacting a second substrate with the film;
- and
- (iii) curing the hot melt adhesive composition.
9 more elements
A process for preparing a laminate article comprises:
- (i) applying, onto a first substrate, a hot melt adhesive composition having a viscosity ranging from 5,000 to 30,000 mPa·s at 125° C., where the hot melt adhesive composition comprises:
- (1) 55 to 62 parts of a silicone resin having a silicon-bonded hydroxyl group content of less than 0.7 wt % based upon the total weight of the silicone resin and comprising monofunctional units represented by R13Si01/2 and tetrafunctional units represented by SiO4/2 where R1 is a substituted or unsubstituted monovalent hydrocarbon radical,
- (2) 38 to 45 parts of a non-functional polyorganosiloxane comprised of difunctional units of the formula R72SiO and terminal units of the formula R8SiG— wherein each R7 and each R8 are independently a substituted or unsubstituted, monovalent hydrocarbon group;
- and G is an oxygen atom or a divalent group linking the silicon atom of the terminal unit with another silicon atom,
- with the proviso that the hot melt adhesive composition has a nonvolatile content of 97.5% to 100%, thereby forming a film;
- (ii) contacting a second substrate with the film;
- and
- (iii) cooling the hot melt adhesive composition.
5 more elements
Dependencies are inferred from the claim text.