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US 8,577,190 B2Granted
Optocoupler
AssigneeAvago Technologies General IP (Singapore) Pte. Ltd.
InventorsGary Tay Thiam Siew, Gopinath Maasi
Life of this patent
Estimating the term…
Abstract
An optocoupler having an optical transmitter die, an optical receiver die, a light guide, a limiting element and a body is disclosed. The light guide is confined to upper portion of the body by using the limiting element. In one embodiment, the limiting element is a dielectric tape. In yet another embodiment, the limiting element is a pre-molded plastic attached to the lead frame via non-conductive epoxy. The use of the limiting element yields light guides having consistent shape.
Claims20
A packaging for an opto-electronic device, comprising:
- a body;
- a first optical transmitter die configured to emit light;
- a first optical receiver die configured to receive a portion of the light emitted by the first optical transmitter die;
- a conductive pad, the conductive pad having a component side and an opposing side that opposes the component side with at least one of the first optical transmitter and receiver dies being mounted on the component side of the conductive pad;
- a first light guide configured to transmit light adjacent to the component side of the conductive pad, from the first optical transmitter die to the first optical receiver die;
- a limiting element configured to confine the first light guide to the component side of the conductive pad when the first light guide is in liquid form prior to being hardened into solid form so as to substantially eliminate light transmission along the opposite side of the conductive pad;
- an attachment layer sandwiched between the opposing side of the conductive pad and the limiting element;
- and
- an opaque encapsulant encapsulating the first light guide and the limiting element forming the body.
6 more elements
An optocoupler comprising:
- a body;
- a first optical transmitter die configured to emit light;
- a first optical receiver die configured to receive light emitted by the first optical transmitter die;
- an attachment layer;
- a plurality of conductive leads, wherein at least one of the conductive leads forms a conductive pad to receive at least one of the first optical transmitter and receiver dies;
- a component side of the conductive pad configured to receive at least one of the first optical transmitter and receiver die;
- an opposing side of the conductive pad opposing the component side configured to receive the attachment layer;
- a tape attached to the opposing side of the conductive pad through the attachment layer such that the attachment layer is sandwiched between the tape and the conductive pad;
- a light guide encapsulating the first optical transmitter and receiver dies on the tape, wherein the tape is configured to confine the light guide when the light guide is in liquid form prior to being hardened into solid form so that the light guide is configured to transmit light adjacent to the component side of the conductive pad and substantially eliminate light transmission along the opposite side of the conductive pad;
- and
- an opaque encapsulant encapsulating the light guide and the tape forming the body.
8 more elements
An opto-electronic device, comprising:
- a body having an upper portion and a lower portion;
- an optical transmitter die configured to emit light;
- an optical receiver die configured to receive light emitted by the optical transmitter die;
- a plurality of conductive leads, wherein the optical transmitter and receiver dies are mounted on at least one of the conductive leads interposed between the upper and lower portion of the body;
- a light guide encapsulating the optical transmitter die and receiver dies configured to transfer light from the optical transmitter die to the optical receiver die located on the upper portion of the body;
- a thin dielectric tape attached to the at least one of the conductive leads, the thin dielectric tape being configured to confine the light guide to the upper portion of the body when the light guide is in liquid form before being hardened into solid form, so as light transmission is confined to the upper portion of the body;
- and
- an attachment layer sandwiched between the at least one of the conductive leads and the dielectric tape.
5 more elements
Dependencies are inferred from the claim text.