Robust power plane configuration in printed circuit boards
AssigneeInternational Business Machines Corporation
InventorsRobert L. Ayers, Michael L. Scollard, Heidi D. Williams
Life of this patent
Estimating the term…
Abstract
A robust printed circuit board (PCB) that includes at least two power layers that are used in providing power to components connected to the PCB. The power layers may be a power plane layer and a ground plane layer. The power plane layer is situated such that its edge is pulled back a second distance from the planar edge of the PCB. The ground plane layer is situated such that its edge is pulled back a first distance from the planar edge of the PCB. The second distance and the first distance are different, and as a result, the planar edges of the power plane layer and the ground plane layer respectively do not coincide.
Claims20
A printed circuit board (PCB) comprising:
- a laminate layer defining an outermost planar boundary for the PCB;
- a ground plane layer having a first voltage and having a first planar boundary situated a first distance from the outermost planar boundary of the PCB;
- an insulation layer situated between the ground plane layer and a power plane layer, the insulation layer having a first orthogonal thickness;
- and
- the power plane layer having a second voltage of magnitude greater than the first voltage, and a second planar boundary situated a second distance, larger than the first distance, from the outermost planar boundary of the PCB, wherein a difference between the first distance and the second distance is at least twice the first orthogonal thickness,
- wherein from the first planar boundary to the outermost planar boundary of the PCB and from the second planar boundary to the outermost planar boundary of the PCB is filled with a filler that is non-conductive.
A printed circuit board (PCB) comprising:
- a planar edge of the PCB, the planar edge of the PCB defining an outward extent of the PCB;
- a first power layer having a first voltage and a first planar edge situated a first distance from the planar edge of the PCB;
- and
- a second power layer having a second voltage and a second planar edge situated a second distance from the planar edge of the PCB, wherein the second distance is larger than the first distance, and wherein the second voltage is different than the first voltage,
- wherein the PCB is non-conductive from the first planar edge to the planar edge of the PCB and from the second planar edge to the planar edge of the PCB.
A computer system comprising:
- a processor;
- a memory;
- a printed circuit board (PCB) comprising:
- a planar edge of the PCB, the planar edge of the PCB defining an outward extent of the PCB;
- a first power layer having a first voltage and a first planar edge situated a first distance from the planar edge of the PCB;
- and
- a second power layer having a second voltage and a second planar edge situated a second distance from the planar edge of the PCB, wherein the second distance is larger than the first distance, and wherein the second voltage is different than the first voltage,
- wherein the PCB is non-conductive from the first planar edge to the planar edge of the PCB and from the second planar edge to the planar edge of the PCB.
A method for making a printed circuit board (PCB) comprising:
- making a planar edge of the PCB, the planar edge of the PCB defining an outward extent of the PCB;
- inserting a first power layer in the PCB, the first power layer having a first voltage;
- situating a first planar edge of the first power layer a first distance from the planar edge of the PCB;
- inserting a second power layer in the PCB, the second power layer having a second voltage that is different than the first voltage;
- and
- situating a second planar edge of the second power layer a second distance from the planar edge of the PCB, wherein the second distance is larger than the first distance
- wherein the PCB is non-conductive from the first planar edge to the planar edge of the PCB and from the second planar edge to the planar edge of the PCB.
Dependencies are inferred from the claim text.