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US 8,576,567 B2Granted
Semiconductor device and display apparatus
AssigneeSharp Kabushiki Kaisha
InventorsTatsuya Katoh, Takuya Sugiyama, Yasunori Chikawa
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Abstract
A COF includes, in at least one embodiment, a heat dissipating material on a back surface of an insulating film. The heat dissipating material has a slit for reducing a degree of thermal expansion. Thus, at least one embodiment of the invention provides the COF in which deformation and disconnection of wiring are prevented.
Claims25
A semiconductor device, comprising:
- an insulating film;
- a wiring provided on a first surface of the insulating film;
- a semiconductor element provided on the wiring;
- and
- a heat dissipating member provided on a second surface of the insulating film which second surface is opposite to the first surface, wherein the heat dissipating member comprises a first heat dissipating member, and the first heat dissipating member comprises at least one slit;
- the at least one slit is provided in the first heat dissipating member along a center line of the semiconductor element;
- and
- the at least one slit comprises at least one second slit provided in a region of the first heat dissipating member which region corresponds to an edge of the semiconductor element and a vicinity of the edge, said at least one second slit forming a radius of a sector of a circle, wherein a tip of a wedge angle of the sector is located along a center line of the first heat dissipating member.
5 more elements
Dependencies are inferred from the claim text.