Systems and method of a carrier device for placement of thermal interface materials

A structure comprising:

• a rigid material that defines an outer surface and an inner surface opposite the outer surface;
• a first quadrilateral area defined by the rigid material, the first quadrilateral area defining a first plane on the inner surface and a second plane on the outer surface;
• a second quadrilateral area defined by the rigid material, the second quadrilateral area defining a third plane on the inner surface and a fourth plane on the outer surface, the first and third planes being parallel but not co-planar, and the second and fourth planes being parallel but not co-planar;
• a first aperture between the first and second planes through the first quadrilateral area;
• and
• a second aperture between the third and fourth planes through the second quadrilateral area.

A method comprising:

• selecting a carrier device from a source of previously manufactured carrier devices, the carrier device comprising:
• a rigid material that defines an outer surface and an inner surface opposite the outer surface;
• a first quadrilateral area defined by the rigid material, the first quadrilateral area defining a first lane on the inner surface and a second plane on the outer surface;
• a second quadrilateral area defined by the rigid material, the second quadrilateral area defining a third plane on the inner surface and a fourth plane on the outer surface, the first and third planes being parallel but not co-planar, and the second and fourth planes being parallel but not co-planar;
• a first aperture between the first and second planes through the first quadrilateral area;
• a second aperture between the third and fourth planes through the second quadrilateral area;
• placing the carrier device over an electronics module;
• thermally coupling a metallic structure to a first electrical component on the electronics module through a first thermal interface material disposed within the first aperture;
• and
• thermally coupling the metallic structure to a second electrical component on the electronics module through a second thermal interface material disposed within the second aperture.