Casing structure for electronic devices
AssigneeLenovo (Singapore) Pte. Ltd.
InventorsGang Ji, Tetsuya Ohtani, Takayuki Morino, Akinori Uchino
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Abstract
An aspect provides a method, including: fixing a laminated panel, which has been cut into a predetermined shape, to a mold, said laminated panel having an expanded layer disposed between layers made of a conductive resin; injection of molding non-conducting resin into the mold in which the laminated panel has been fixed; wherein a non-conductive region and a conductive region are joined to form a bottom surface of a display casing, said display casing having an inner and outer surface; and wherein an antenna mounting space is formed in the non-conductive region. Other aspects are described and claimed.
Claims10
A method, comprising:
- fixing a laminated panel, which has been cut into a predetermined shape, to a mold, said laminated panel having an expanded layer disposed between layers made of a conductive resin;
- injection of molding non-conducting resin into the mold in which the laminated panel has been fixed;
- wherein a non-conductive region and a conductive region are joined to form a bottom surface of a display casing, said display casing having an inner and outer surface;
- and
- wherein an antenna mounting space is formed in the non-conductive region.
A method comprising:
- fixing a laminated panel, which has been cut into a predetermined shape, to a mold, said laminated panel having an expanded layer disposed between layers made of carbon fiber reinforced plastic;
- and
- injection molding glass fiber reinforced plastic into the mold in which the laminated panel has been fixed;
- wherein a glass fiber reinforced plastic region and a carbon fiber reinforced plastic region are butt joined to form a bottom surface of a display casing;
- and
- wherein an antenna mounting space is formed in the glass fiber reinforced plastic region.
Dependencies are inferred from the claim text.