RFID transponder, in particular for assembly on metal and manufacturing method therefor

A manufacturing method for an RFID transponder comprising:

• providing an antenna;
• providing a chip comprising at least one transmission and reception circuit as well as a memory;
• disposing the at least sectional covering of a first surface of a dielectric carrier element with a first metallization and the at least sectional covering of a second surface of the dielectric carrier element opposite the first surface with a second metallization;
• arranging the electrically conductive mutual connection of the first and second metallizations and the forming thereby of the antenna and the structuring of the first metallization such that it forms two electrical terminals of the antenna on the first surface of the dielectric carrier element;
• arranging the electric contacting of the chip via these two terminals and the chip on the first surface and/or the at least sectional integrating of the chip into this surface;
• and
• structuring the formation carried out at least partly by the first metallization of an adaptation network such that the input impedance of the antenna is adapted in a conjugate complex manner to the impedance of the chip, the adaptation network having a first capacitance Cser which is connected in series to the chip and a second capacitance Cshunt which is connected in parallel to this series connection of the chip and first capacitance Cser.

An RFID transponder comprising:

• an antenna;
• a chip comprising at least one transmission and reception circuit as well as a memory;
• a dielectric carrier element which is covered on a first surface at least sectionally with a structured first metallization and which is covered on a second surface disposed opposite the first surface at least sectionally with a second metallization;
• the first and second metallizations being jointly electrically conductively connected, thereby forming the antenna, the first metallization being structured such that it forms two electric terminals of the antenna arranged on the first surface of the dielectric carrier element, and the chip can be or is electrically contacted via these two terminals and is positionable or is arranged on the first surface and/or is positionable or is arranged at least sectionally integrated into this surface;
• and
• an adaptation network at least partly formed by the structuring of the first metallization and adapting the input impedance of the antenna in a conjugate complex manner to the impedance of the chip,
• the dielectric carrier element and the antenna being made such that
• λ
• 0
• 8
• ⁢
• ɛ
• r_eff
• ≤
• L
• ≤
• 3
• ⁢
• λ
• 0
• 4
• ⁢
• ɛ
• r_eff
• applies with ∈r—eff as the effective permittivity of the material of the dielectric carrier element, with L as the total length of the antenna and with λ0 as a predetermined wavelength from one of the three UHF bands 865 to 868 MHz, 902 to 928 MHz and 950 to 956 MHz.