Planar magnetic field probe
AssigneeTatung Co., Ltd.
InventorsShih-Chieh Chao, Chih-Wen Huang
Life of this patent
Estimating the term…
Abstract
A planar magnetic field probe is provided. The planar magnetic field probe increases the sensitivity of magnetic field intensity detection by using a left multi-sensor loop and a right multi-sensor loop formed by a first patterned metal layer and a second patterned metal layer, and decreases the electric field noise coupling by surrounding the left multi-sensor loop and the right multi-sensor loop with a symmetrical shielding metal structure formed by a first patterned shielding metal layer, a second patterned shielding metal layer and a plurality of through vias.
Claims10
A planar magnetic field probe, for detecting a magnetic field intensity generated by a current of a signal line to be detected, the planar magnetic field probe comprising:
- a first substrate;
- a second substrate, located on the first substrate;
- a first through via, penetrating through the first substrate and the second substrate;
- a second through via, penetrating through the first substrate and the second substrate;
- a first patterned induction metal layer, formed between the first substrate and the second substrate, and the first patterned induction metal layer comprising:
- a first induction loop pattern, having a first end and a second end, and the first end of the first induction loop pattern being connected to the first through via;
- a second induction loop pattern, having a first end and a second end, and the first end of the second induction loop pattern being connected to the second through via;
- and
- a induction wire, having a first end and a second end respectively connected to the second end of the first induction loop pattern and the second end of the second induction loop pattern, wherein induction currents generated by induction the magnetic field intensity by the first induction loop pattern and the second induction loop pattern have a same current direction on the induction wire;
- a first patterned shielding metal layer;
- and
- a second patterned shielding metal layer, wherein the second patterned shielding metal layer and the first patterned shielding metal layer are respectively formed on outer sides of the first substrate and the second substrate,
- wherein the first patterned shielding metal layer comprises two first symmetric ring-shape patterns,
- the second patterned shielding metal layer comprises two second symmetric ring-shape patterns, projection areas of the two first symmetric ring-shape patterns on the second patterned shielding metal layer are overlapped to the two second symmetric ring-shape patterns, projection areas of the first induction loop pattern and the second induction loop pattern on the second patterned shielding metal layer are respectively located within the two second symmetric ring-shape patterns, and the first through via and the second through via are located between the two second symmetric ring-shape patterns and are respectively located at two sides of the induction wire.
Dependencies are inferred from the claim text.