Semiconductor package having underfill agent dispersion

A semiconductor package comprising:

• a wiring board comprising a first surface and a second surface opposite to the first surface;
• a plurality of pad groups on the first surface of the wiring board, each comprising a plurality of first pads to which an external device is to be electrically connected and which are arranged in a line, wherein each of the pad groups is arranged along a corresponding side of the wiring board;
• a solder resist on the first surface of the wiring board and comprising a plurality of elongated openings therethrough, wherein each of the pad groups is exposed from a corresponding one of the elongated openings, and wherein each of the openings is arranged along a corresponding side of the wiring board;
• a plurality of second pads for flip-chip mounting, which are provided on the first surface of the wiring board to be exposed from the solder resist;
• a semiconductor element flip-chip mounted on the first surface of the wiring board to be electrically connected to the plurality of second pads, wherein the semiconductor element is surrounded by the respective elongated openings, and the respective elongated openings are formed between the corresponding side of the wiring board and a corresponding side of the semiconductor element;
• an underfill agent provided between the semiconductor element and the solder resist, wherein each of the elongated openings comprises:
• a first long side facing the semiconductor element;
• a second long side facing the corresponding side of the wiring board and being opposite to the first long side;
• a first short side;
• and
• a second short side opposite to the first short side, wherein the second short side of one of the elongated openings faces the first short side of another one of the elongated openings which is located adjacent to said one of the elongated openings, and
• wherein an angle formed between the first short side and the first long side is an obtuse angle, and an angle formed between the second short side and the first long side is an obtuse angle.