Semiconductor device and method for manufacturing semiconductor device

A semiconductor device comprising;

• a semiconductor chip having a passivation film on a front surface thereof which is a functional surface;
• a sealing resin layer provided over the passivation film for sealing the front surface of the semiconductor chip, the sealing resin layer extending to a side surface of the passivation film such that the sealing layer covers the side surface of the passivation film;
• and
• a stress relieving layer having an upper surface and a side surface provided between the passivation film and the sealing resin layer for absorbing and relieving an externally applied stress;
• and
• a rewiring provided on the upper surface of the stress relieving layer, the rewiring having a side surface positioned inside of the stress relieving layer such that the upper surface of the stress relieving layer is partly exposed;
• wherein both the sealing resin layer and the stress relieving layer are in direct contact with an upper surface of the passivation film, and
• the sealing resin layer entirely covers the stress relieving layer, the passivation film and the rewiring.