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US 8,575,756 B2Granted
Power package module with low and high power chips and method for fabricating the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorBum Sik Jang
Life of this patent
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Abstract
Disclosed herein are a power package module and a method for fabricating the same, including: a base substrate; a plurality of high power chips and a plurality of low power chips electrically connected to the base substrate; and a plurality of metal lead plates electrically connecting the plurality of high power chips and the plurality of low power chips to the base substrate.
Claims28
A power package module, comprising:
- a base substrate;
- a plurality of high power chips mounted on the base substrate to be electrically connected to the base substrate;
- a plurality of low power chips mounted on the base substrate to be electrically connected to the base substrate;
- a plurality of metal lead plates electrically connecting the plurality of high power chips, the plurality of low power chips and the base substrate;
- and
- an adhesive layer electrically connecting the metal lead plate to the base substrate, the high power chip, and the low power chip.
3 more elements
A method for fabricating a power package module, comprising:
- preparing a base substrate;
- mounting a plurality of high power chips and a plurality of low power chips, electrically connected to the base substrate;
- and
- mounting a plurality of metal lead plates on the base substrate, the plurality of metal lead plates connecting the plurality of high power chips and the plurality of low power chips to the base substrate,
- wherein the preparing the base substrate comprises forming an anodizing layer by anodizing a metal layer and forming a circuit layer on one surface of the anodizing layer to form the circuit layer as an anodizing substrate.
2 more elements
A power package module, comprising:
- a base substrate;
- a plurality of high power chips mounted on the base substrate to be electrically connected to the base substrate;
- a plurality of low power chips mounted on the base substrate to be electrically connected to the base substrate;
- and
- a plurality of metal lead plates formed in a body and electrically connecting the base substrate, the plurality of high power chips and the plurality of low power chips,
- wherein the plurality of high power chips and the plurality of low power chips are sequentially mounted on the base substrate in an alternating manner, and
- wherein the metal lead plate comprises
- a high power chip connection part connected to the high power chip;
- a low power chip connection part connected to the low power chip;
- a base substrate connection part connected to the base substrate;
- a first connection part connecting the high power chip connection part to the base substrate connection part;
- a second connection part connecting the low power chip connection part to the base substrate connection part;
- and
- a third connection part connecting the high power chip to the low power chip;
- and
- wherein the first connection part, the second connection part, and the third connection part have a bending portion.
13 more elements
A method for fabricating a power package module, comprising:
- preparing a base substrate;
- sequentially mounting a plurality of high power chips and a plurality of low power chips in an alternating manner, electrically connected to the base substrate;
- and
- mounting a plurality of metal lead plates on the base substrate, wherein the plurality of metal lead plates are formed in a body and electrically connect the plurality of high power chips and the plurality of low power chips to the base substrate.
1 more element
Dependencies are inferred from the claim text.