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US 8,575,747 B2Granted
Clip interconnect with encapsulation material locking feature
AssigneeIntersil Americas Inc.
InventorRandolph Cruz
Life of this patent
Estimating the term…
Abstract
A clip interconnect comprises a columnar part, a bridge part, and a locking feature. The bridge part has a plurality of sides. The columnar part and the bridge part are configured to form an angle at an interface between the columnar part and the bridge part. The locking feature is located in at least one of the plurality of sides of the bridge part. The locking feature comprises an alternating pattern of teeth and valleys.
Claims31
A clip interconnect comprising:
- a columnar part;
- a bridge part, the bridge part having a plurality of sides, wherein the columnar part and the bridge part are configured to form an angle at an interface between the columnar part and the bridge part;
- and
- a locking feature located in at least one of the plurality of sides of the bridge part, the locking feature comprising an alternating pattern of teeth and valleys.
1 more element
A semiconductor die package comprising:
- a die pad having a top surface;
- a semiconductor die having a top surface and a bottom surface, the bottom surface of the semiconductor die attached to the top surface of the die pad;
- and
- a clip mount attached to the top surface of the semiconductor die, wherein the clip mount comprises:
- a columnar part;
- a bridge part, the bridge part having a plurality of sides, wherein the columnar part and the bridge part are configured to form an angle at an interface between the columnar part and the bridge part;
- and
- a locking feature located in at least one of the plurality of sides of the bridge part, the locking feature comprising an alternating pattern of teeth and valleys.
5 more elements
A system comprising:
- processing circuitry configured to output processed data and signals;
- and
- a power converter coupled to a power source and configured to convert power from the power source to a power level or a polarity usable by the processing circuitry;
- wherein the power converter includes at least one semiconductor die package, the semiconductor die package comprising:
- a leadframe;
- a semiconductor die attached to a top surface of the leadframe;
- a contact region;
- and
- a clip mount having a bridge portion and a columnar portion forming an angle at a junction between the bridge portion and the columnar portion;
- wherein the columnar portion is coupled to the contact region and the bridge portion is coupled to a top surface of the semiconductor die;
- wherein the bridge portion comprises a plurality of sides, at least one of the plurality of side having a locking feature formed from a plurality of protrusions, the locking feature comprising an alternating pattern of teeth and valleys.
8 more elements
A method of manufacturing a clip mount, the method comprising:
- forming a locking feature comprising an alternating pattern of of teeth and valleys into at least a portion of one or more sides of a sheet of electrically conductive material;
- and
- configuring the sheet of electrically conductive material to form a columnar part and a bridge part that form an angle at an interface between the columnar part and the bridge part, the locking feature formed into at least one side of the bridge part.
Dependencies are inferred from the claim text.