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US 8,575,746 B2Granted
Chip on flexible printed circuit type semiconductor package
AssigneeSamsung Electronics Co., Ltd.
InventorsSi-Hoon Lee, Sa-Yoon Kang, Kyoung-Sei Choi
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Abstract
A Chip on Flexible Printed Circuit (COF) type semiconductor package may include a flexible film, a semiconductor IC chip on the flexible film, and a heating pad on the flexible film.
Claims34
A flexible semiconductor package comprising:
- a stack comprising:
- a flexible film substrate;
- a semiconductor chip on the flexible substrate;
- a metal pad layer positioned to dissipate heat generated from the semiconductor chip;
- and
- an insulating flexible reinforcement film attached to a major surface of the metal pad layer,
- wherein the flexible reinforcement film has an outer position in the stack with respect to the flexible film substrate, the semiconductor chip and the metal pad layer.
4 more elements
A Chip on Flexible Printed Circuit (COF) type semiconductor package comprising:
- an insulating flexible film substrate including an upper surface and a lower surface;
- a semiconductor chip on the upper surface of the flexible film substrate;
- a metal pad attached to the lower surface of the flexible film substrate at a location underneath the semiconductor chip to dissipate heat generated from the semiconductor chip;
- a first adhesive layer on the lower surface of the flexible film substrate attaching the metal pad to the lower surface of the flexible film substrate;
- and
- a reinforcement layer on the lower surface of the flexible film substrate,
- wherein the metal pad is interposed between the reinforcement layer and the flexible film substrate.
4 more elements
A display device comprising:
- an insulating flexible film substrate including an upper surface and a lower surface;
- a semiconductor chip on the upper surface of the flexible film substrate;
- a metal pad attached to the lower surface of the flexible film substrate at a location underneath the semiconductor chip to dissipate heat generated from the semiconductor chip;
- a first adhesive layer on the lower surface of the flexible film substrate attaching the metal pad to the lower surface of the flexible film substrate;
- a reinforcement layer on the lower surface of the flexible film substrate, wherein the metal pad is interposed between the reinforcement layer and the flexible film substrate;
- and
- a display panel board wherein the flexible film substrate is connected to the display panel board.
4 more elements
A flexible semiconductor package comprising:
- a flexible film;
- a semiconductor chip on an upper surface of the flexible film;
- a composite layer comprising a metal layer to dissipate heat generated from the semiconductor chip, a reinforcement layer and an adhesive attaching the metal layer and the reinforcement layer,
- wherein the composite layer is disposed on the lower surface of the flexible film,
- wherein the metal layer is disposed between the flexible film and the reinforcement layer,
- wherein at a side of the composite layer, edges of the metal layer and the reinforcement layer are aligned.
3 more elements
Dependencies are inferred from the claim text.