Printed board and semiconductor integrated circuit

A printed board comprising:

• a first circuit, a plurality of first pairs of terminals each including a first power supply terminal and a first GND terminal, which is connected to said first circuit, a second circuit, a plurality of second pairs of terminals each including a second power supply terminal and a second GND terminal, connected to said second circuit, and an IC, said first pairs of terminals and said second pairs of terminals being isolated, wherein said first circuit operates by higher frequency than said second circuit;
• first GND patterns connected to said plurality of first GND terminals;
• a second GND pattern isolated from said first GND patterns and connecting to said plurality of second GND terminals;
• and
• a first suppressing unit configured to suppress propagation of the high-frequency noise from the first circuit, provided between said first GND patterns and said second GND pattern,
• wherein said first GND patterns connecting to at least two first GND terminals of a plurality of first GND terminals are provided in a portion arranged inside a terminal array of said IC and a portion arranged outside said terminal array of said IC,
• wherein said first GND pattern provided in said portion inside said terminal array of said IC is larger in size than is said first GND pattern provided in said portion outside said terminal array of said IC, and
• wherein said first GND patterns and said second GND patterns are isolated inside said terminal array of said IC.