Col-based semiconductor package including electrical connections through a single layer leadframe
AssigneeSanDisk Technologies LLC
InventorsSuresh Upadhyayula, Ming Hsun Lee, Hem Takiar
Life of this patent
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Abstract
A semiconductor package is disclosed including a leadframe, memory die and controller die, one or more of which are customized to facilitate electrical connection of the memory and controller die bond pads to the contact pads of the host device via the leadframe. By customizing one or more of the leadframe, memory die and controller die, an interposer layer normally required to connect the die in the semiconductor package with a host device may be omitted.
Claims24
A semiconductor package for transferring signals to and from contact pads of a host device, the semiconductor package, comprising:
- a leadframe including a plurality of leads;
- a memory die mounted to the leadframe, the memory die including memory die bond pads;
- a controller die mounted on the leadframe, the controller die including controller die bond pads;
- a first set of wire bonds between the memory die bond pads and a first set of leads of the plurality of leads of the leadframe;
- and
- a second set of wire bonds between the memory die bond pads and a second set of leads of the plurality of leads of the leadframe;
- wherein the plurality of leads of the leadframe are customized with a purpose of enabling the memory die bond pads to be electrically connected to the contact pads of the host device, and the controller die bond pads to be electrically connected to the contact pads of the host device, entirely by the plurality of leads of the leadframe and the first and second sets of wire bonds.
A semiconductor package for transferring signals to and from contact pads of a host device, the semiconductor package, comprising:
- a leadframe including a plurality of leads;
- a memory die mounted to the leadframe, the memory die including memory die bond pads;
- a controller die mounted on the leadframe, the controller die including controller die bond pads;
- wherein the plurality of leads of the leadframe are configured so as to enable signals to be transferred between the memory die bond pads and the contact pads of the host device, and between the controller die bond pads and the contact pads of the host device, without assistance of an interposer layer.
A semiconductor package for transferring signals to and from contact pads of a host device, the semiconductor package, comprising:
- a leadframe including a plurality of leads;
- a memory die mounted to the leadframe, the memory die including memory die bond pads;
- a controller die mounted on the leadframe, the controller die including controller die bond pads;
- wherein each of:
- a) the leads of the leadframe, b) the positions of the memory die bond pads, and c) the positions of the controller die bond pads are customized to facilitate electrical connection of the memory and controller die bond pads to the contact pads of the host device via the leadframe.
Dependencies are inferred from the claim text.