US 8,575,738 B2Granted

Semiconductor memory card

AssigneeKabushiki Kaisha Toshiba

InventorsKazuhide Doi, Naohisa Okumura, Taku Nishiyama, Katsuyoshi Watanabe, Takeshi Ikuta

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Abstract

In an embodiment, a semiconductor memory card includes a lead frame including external connection terminals, a lead portion, a chip component mounting portion and a semiconductor chip mounting portion, a chip component mounted on the chip component mounting portion, a memory chip disposed on the semiconductor chip mounting portion, and a controller chip. A rewiring layer is formed on a surface of the memory chip. The lead frame is resin-sealed. An electric circuit of the controller chip and the memory chip on the lead frame is formed by the lead portion, the rewiring layer and a metal wire connected to electrode pad of the chips, the lead portion, and the rewiring layer.

Claims20

Dependent claims

A semiconductor memory card, comprising:

a lead frame including a plurality of external connection terminals, a lead portion having a plurality of leads, a chip component mounting portion provided to the lead portion, and a semiconductor chip mounting portion, at least part of the leads being connected to the external connection terminals;
a chip component mounted on the chip component mounting port ion and electrically connected to the lead portion;
a memory chip, disposed on the semiconductor chip mounting portion, having a chip body, first electrode pads formed on the chip body, an insulating resin film formed to cover a surface of the chip body while exposing the first electrode pads, and a rewiring layer formed on the insulating resin film;
a controller chip, disposed on the semiconductor chip mounting portion or the memory chip, having second electrode pads;
and
a sealing resin layer sealing the chip component, the memory chip, the controller chip and the lead frame while exposing the external connection terminals,
wherein an electric circuit of the memory chip and the controller chip on the lead frame is formed by the leads, the rewiring layer, and a metal wire connected to at least one selected from the first electrode pad, the second electrode pad, the lead and the rewiring layer.

4 more elements

A semiconductor memory card, comprising:

a lead frame including a plurality of external connection terminals, a lead portion having a plurality of leads, a chip component mounting portion provided to the lead portion, and a semiconductor chip mounting portion, at least part of the leads being connected to the external connection terminals;
a chip component mounted on the chip component mounting portion and electrically connected to the lead portion;
a memory chip, disposed on the semiconductor chip mounting portion, having first electrode pads;
a controller chip, disposed on the semiconductor chip mounting portion or the memory chip, having second electrode pads;
metal wires electrically connecting between the leads and the first electrode pads, between the leads and the second electrode pads, and between the first electrode pads and the second electrode pads;
and
a sealing resin layer sealing the chip component, the memory chip, the controller chip, the metal wires, and the lead frame while exposing the external connection terminals,
wherein the sealing resin has a first surface on which the external connection terminals are exposed and a second surface opposed to the first surface, and
wherein the lead frame has a first processed portion and a second processed portion, the first processed portion is formed by bending the lead frame to expose the external connection terminals on the first surface of the sealing resin layer and to be positioned the semiconductor chip mounting portion inside the sealing resin layer, and the second processed portion is formed by bending the lead frame to be positioned the chip component mounting portion closer to the first surface of the sealing resin layer than the semiconductor chip mounting portion.

6 more elements

Dependencies are inferred from the claim text.