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US 8,575,735 B2Granted
Semiconductor chip and film and TAB package comprising the chip and film
AssigneeSamsung Electronics Co., Ltd.
InventorsYoung-Sang Cho, Chang-Sig Kang, Dae-Woo Son, Yun-Seok Choi, Kyong-Soon Cho, Sang-Heul Lee
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Abstract
A semiconductor chip for a tape automated bonding (TAB) package is disclosed. The semiconductor chip comprises a connection surface including a set of input pads connected to internal circuitry of the chip and for conveying external signals to the internal circuitry, the set of input pads comprising all of the input pads on the chip. The connection surface includes a set of output pads connected to internal circuitry of the chip and for conveying internal chip signals to outside the chip, the set of output pads comprising all of the output pads on the chip.
Claims12
A film for a tape automated bonding (TAB) package comprising:
- an input terminal at a first side of the film;
- an output terminal at a second side of the film opposite the first side;
- a chip-mounting area for mounting over a surface of a chip that includes a first edge and a second edge that are substantially parallel to each other and are opposite each other on a respective first side and second side of the chip, the chip-mounting area including:
- an inner area and an outer area, wherein the outer area includes at least a first portion located between the inner area and a first outer border of the chip-mounted area that corresponds to the first edge, and at least a second portion located between the inner area and a second outer border of the chip-mounted area that corresponds to the second edge;
- a plurality of input leads extending from the first portion of the outer area of the chip-mounted area to the input terminal, the input leads arranged to connect to corresponding input pads of the chip;
- a plurality of first output leads extending from the second portion of the outer area of the chip-mounted area to the output terminal, the first output leads arranged to connect to corresponding first output pads of the chip;
- and
- a plurality of second output leads extending from the inner area of the chip-mounted area to the output terminal, the second output leads arranged to connect to corresponding second output pads of the chip;
- wherein at least part of at least a first of the plurality of second output leads extends from the inner area of the chip-mounted area in a direction toward the first edge.
6 more elements
A tape automated bonding (TAB) package comprising:
- a film;
- and
- a semiconductor chip, the semiconductor chip mounted on the film,
- wherein the semiconductor chip comprises:
- a connection surface including a first edge and a second edge that are substantially parallel to each other and are opposite each other on a respective first side and second side of the chip, and a third edge and fourth edge that are substantially perpendicular to the first and second edges, and are opposite each other on a respective third side and fourth side of the chip;
- a plurality of input pads adjacent the first edge and arranged in a first direction;
- a plurality of first output pads adjacent the second edge and arranged in the first direction;
- and
- a plurality of second output pads located between the plurality of input pads and the plurality of first output pads, and including at least first and second outermost pads located a certain distance from the respective third edge and fourth edge, and at least first and second inner pads located a greater distance from the respective third edge and fourth edge than the first and second outermost pads,
- wherein the film comprises:
- an input terminal at a first side of the film and an output terminal at a second side of the film opposite the first side;
- a chip-mounted area including an inner area and an outer area, wherein the outer area includes at least a first portion located between the inner area and a first outer border of the chip-mounted area that corresponds to the first edge, and at least a second portion located between the inner area and a second outer border of the chip-mounted area that corresponds to the second edge;
- a plurality of input leads extending from the first portion of the outer area of the chip-mounted area to the input terminal;
- a plurality of first output leads extending from the second portion of the outer area of the chip-mounted area to the output terminal;
- and
- a plurality of second output leads extending from the inner area of the chip-mounted area to the output terminal, and
- wherein:
- the plurality of input pads are connected respectively to the plurality of input leads;
- the plurality of first output pads are connected respectively to the plurality of first output leads;
- and
- the plurality of second output pads are connected respectively to the plurality of second output leads.
18 more elements
Dependencies are inferred from the claim text.