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US 8,575,646 B1Granted
Creating an LED package with optical elements by using controlled wetting
AssigneeApplied Lighting Solutions, LLC
InventorFrank Shum
Life of this patent
Estimating the term…
Abstract
A method of producing a LED package through controlled wetting.
Claims20
An LED device comprising:
- a LED chip;
- at least one optically transmissive material encapsulating the LED chip;
- a substrate surface comprises a patterned coating comprising a plurality of pins;
- at least one hydrophilic region on the substrate;
- at least one enhanced hydrophobic region on the substrate, wherein the hydrophobic region is planar with the hydrophilic region, and
- the at least one enhanced hydrophobic region is formed by coating with a hydrophobic or super hydrophobic material, wherein the hydrophilic region is selected from at least from of the following material or their derivates:
- nanopin film, polytetrafluoroethylene, Lightspan Product LS (1,2,5,10)-2233, heptadecafluorodecyltrimethoxysilane, poly(tetrafluoroethylene), poly(propylene), octadecyldimethylchlorosilane, octadecyltrichlorosilane, tris(trimethylsiloxy)silylethyldimethylchlorosilane, octyldimethylchlorosilane, dimethyldichlorosilane, butyldimethylchlorosilane, trimethylchlorosilane, poly(ethylene), poly(styrene), poly(chlorotrifluoroethylene), heptadecafluorodecyltrichlorosilane, polytetrafluoroethylene, octadecyltrichlorosilane, methyltrimethoxysilane, nonafluorohexyltrimethoxysilane, vinyltriethoxysilane, paraffin wax, ethyltrimethoxysilane, propyltrimethoxysilane, soda lime glass, borosilicate glass, poly(chlorotrifluoroethylene), poly(propylene oxide), polyethylene, trifluoropropyltrimethoxysilane 3-(2-aminoethyl)-aminopropyltrimethoxysilane, p-tolyltrimethoxysilane, cyanoethyltrimethoxysilane, aminopropyltriethoxysilane, polymethylmethacrylate, polyvinylchloride, phenyltrimethoxysilane, chloropropyltrimethoxysilane, or mercaptopropyltrimethoxysilane.
4 more elements
An LED device comprising:
- a LED chip;
- at least one silicone material encapsulating the LED chip to form a lens;
- a substrate surface comprises a patterned coating comprising a plurality of pins;
- at least one enhanced hydrophobic region on the substrate;
- and
- a phosphor layer within the encapsulant material, wherein the at least one enhanced hydrophobic region is planar with the phosphor layer, and
- at least one hydrophilic region is selected from at least from of the following material or their derivates:
- nanopin film, polytetrafluoroethylene, Lightspan Product LS (1,2,5,10)-2233, heptadecafluorodecyltrimethoxysilane, poly(tetrafluoroethylene), poly(propylene), octadecyldimethylchlorosilane, octadecyltrichlorosilane, tris(trimethylsiloxy)silylethyldimethylchlorosilane, octyldimethylchlorosilane, dimethyldichlorosilane, butyldimethylchlorosilane, trimethylchlorosilane, poly(ethylene), poly(styrene), poly(chlorotrifluoroethylene), heptadecafluorodecyltrichlorosilane, polytetrafluoroethylene, octadecyltrichlorosilane, methyltrimethoxysilane, nonafluorohexyltrimethoxysilane, vinyltriethoxysilane, paraffin wax, ethyltrimethoxysilane, propyltrimethoxysilane, soda lime glass, borosilicate glass, poly(chlorotrifluoroethylene), poly(propylene oxide), polyethylene, trifluoropropyltrimethoxysilane 3-(2-aminoethyl)-aminopropyltrimethoxysilane, p-tolyltrimethoxysilane, cyanoethyltrimethoxysilane, aminopropyltriethoxysilane, polymethylmethacrylate, polyvinylchloride, phenyltrimethoxysilane, chloropropyltrimethoxysilane, mercaptopropyltrimethoxysilane.
5 more elements
An LED device comprising:
- a LED chip;
- at least one silicone material encapsulating the LED chip to form a lens;
- a substrate surface;
- at least one enhanced hydrophobic region on the substrate;
- and
- a phosphor layer within the encapsulant material, wherein the at least one enhanced hydrophobic region is planar with the phosphor layer, and the substrate surface comprises a patterned coating comprising a plurality of pins.
3 more elements
Dependencies are inferred from the claim text.