Electron beam measurement apparatus
AssigneeHitachi High-Technologies Corporation
InventorsYasunari Sohda, Shoji Hotta, Shinji Okazaki, Muneyuki Fukuda
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Abstract
The present invention provides an electron beam measurement technique for measuring the shapes or sizes of portions of patterns on a sample, or detecting a defect or the like. An electron beam measurement apparatus has a unit for irradiating the patterns delineated on a substrate by a multi-exposure method, and classifying the patterns in an acquired image into multiple groups according to an exposure history record. The exposure history record is obtained based on brightness of the patterns and a difference between white bands of the patterns.
Claims2
An electron beam measurement apparatus, which measures, based on information on an image, patterns formed on a sample, comprising:
- an electron optical system that has a lens and a deflector and scans a predetermined observation region on the sample with an electron beam emitted from an electron source, a detector for detecting a charged particle secondarily generated from the sample by irradiation with the electron beam, and a means for forming an image including forming a secondary electron image using a secondary electron and a reflective electron image using a reflective electron based on the detected charged particle,
- wherein the patterns are delineated in a single layer present on a substrate, and
- further including a means for classifying patterns, which are arranged in an image acquired by the irradiation with the electron beam irradiated on the patterns on the sample, into at least one of first and second groups based on the secondary electron image and the reflective electron image.
Dependencies are inferred from the claim text.